Volume 49, Issue 1

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January 2020

Special Section: TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder. Guest Editors: Kazuhiro Nogita, Tae-Kyu Lee, Zhi-Quan Liu, Arif Salleh, Christopher Gourlay, Yan Li, Albert T. Wu. Special Section: TMS2019 Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVIII. Guest Editor: Hiroshi Nishikawa

99 articles in this issue

The Effect of Ni and Bi Additions on the Solderability of Sn-0.7Cu Solder Coatings
M. I. I. Ramli
M. A. A. Mohd Salleh
K. Nogita
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 11 September 2019 Pages: 1 - 12
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Low Temperature Cu-to-Cu Bonding in Non-vacuum Atmosphere with Thin Gold Capping on Highly (111) Oriented Nanotwinned Copper
Yu-Ting Wu
Chih Chen
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 13 November 2019 Pages: 13 - 17
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Nanomechanical Responses of an Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium
Jenn-Ming Song
Wei-Chih Lu
Pei-Wen Chou
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 06 November 2019 Pages: 18 - 25
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Effect of Chemical Additives in the Plating Bath on Surface Corrosion Resistance of Ni(P)
C. Y. Wu
Y. H. Chen
C. Y. Liu
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 11 October 2019 Pages: 26 - 33
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Decomposed Copper(II) Acetate Over Expanded Graphite (EG) as Hybrid Filler to Fabricate Epoxy Based Thermal Interface Materials (TIMs)
Sagar Kumar Nayak
Smita Mohanty
Sanjay K. Nayak
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 01 November 2019 Pages: 34 - 47
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards
Won Sik Hong
Chulmin Oh
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 05 September 2019 Pages: 48 - 58
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Mechanical Reliability of Photovoltaic Cells under Cyclic Thermal Loading
Dipali Sonawane
Praveen C. Ramamurthy
Praveen Kumar
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 18 September 2019 Pages: 59 - 71
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
A Study on Electrical and Electrochemical Characteristics of Friction Stir Welded Lithium-Ion Battery Tabs for Electric Vehicles
Omkar Mypati
Debasish Mishra
Prakash Srirangam
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 29 October 2019 Pages: 72 - 87
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars
H. Y. Yu
T. H. Yang
C. R. Kao
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 29 July 2019 Pages: 88 - 95
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films
Nalla Somaiah
Praveen Kumar
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 23 September 2019 Pages: 96 - 108
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure
I-Ju Wang
Ching-Shun Ku
Chih Chen
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 12 November 2019 Pages: 109 - 115
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys
André M. Delhaise
Polina Snugovsky
Doug D. Perovic
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 03 October 2019 Pages: 116 - 127
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Properties of CuGa₂ Formed Between Liquid Ga and Cu Substrates at Room Temperature
Shiqian Liu
Stuart McDonald
Kazuhiro Nogita
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 10 October 2019 Pages: 128 - 139
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Orientation Relationships of Pure Tin on Single Crystal Germanium Substrates
Thomas C. Reeve
Samuel Temple Reeve
Carol A. Handwerker
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 01 October 2019 Pages: 140 - 151
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties
Paul T. Vianco
Bonnie B. McKenzie
Alice C. Kilgo
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 29 July 2019 Pages: 152 - 172
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples
Thiago Soares
Clarissa Cruz
Noé Cheung
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 31 July 2019 Pages: 173 - 187
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate
Won Sik Hong
Mi Song Kim
Chulmin Oh
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 25 September 2019 Pages: 188 - 195
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging
Collin Fleshman
Jenq-Gong Duh
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 05 August 2019 Pages: 196 - 201
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields
Yu Tian
Limin Ma
Zhijie Sun
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 16 October 2019 Pages: 202 - 211
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications
Sagar Kumar Nayak
Smita Mohanty
Sanjay K. Nayak
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 22 October 2019 Pages: 212 - 225
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Correlation Between the Growth of Voids and Ni₃Sn₄ Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C
Faramarz Hadian
Harry Schoeller
Eric Cotts
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 31 October 2019 Pages: 226 - 240
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography
Jason J. Williams
Irene Lujan Regalado
Nikhilesh Chawla
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder 30 July 2019 Pages: 241 - 244
Part of 1 collection:

TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Two-Phase η′ + η Region in Cu₆Sn₅ Intermetallic: Insight into the Order–Disorder Transition from Diffusion Couples
Christian Wieser
Werner Hügel
Andreas Leineweber
TMS2019 Phase Stability in Electronic Materials 11 October 2019 Pages: 245 - 256
Part of 1 collection:

TMS2019 Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVIII
Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate
Chia-Yu Liu
Po-Cheng Kuo
Alberto S. Pasana
TMS2019 Phase Stability in Electronic Materials 30 October 2019 Pages: 257 - 267
Part of 1 collection:

TMS2019 Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVIII
Thermal Interface Materials
D. D. L. Chung
Editorial Commentary 21 October 2019 Pages: 268 - 270
Al₂O₃-Doped MoO₃-TeO₂ Glass as Anode Materials for Lithium-Ion Batteries with Long-Term Cycle Life
Jianyu Liu
Guangda Li
Xiaoyun Wei
OriginalPaper 25 October 2019 Pages: 271 - 281
Synthesis and Characterization of LiCrO₂ Thin Films As Potential Cathode Material for Lithium Ion Batteries
H. I. Elsaeedy
OriginalPaper 12 November 2019 Pages: 282 - 289
Electronic and Magnetic Tunability of SnSe Monolayer via Doping of Transition-Metal Atoms
Jiating Lu
Lishuai Guo
Xi Zhang
OriginalPaper 29 October 2019 Pages: 290 - 296
Schottky Barrier Parameters and Low-Frequency Noise Characteristics of Au/Ni Contact to n-Type β-Ga₂O₃
P. R. Sekhar Reddy
V. Janardhanam
Chel-Jong Choi
OriginalPaper 18 October 2019 Pages: 297 - 305
Design Optimization for Maximized Thermoelectric Generator Performance
A. Narjis
C.-T. Liang
A. Outzourhit
OriginalPaper 29 October 2019 Pages: 306 - 310
A Simple and Rapid Method to Produce SERS Substrates Using Au Nanoparticles Prepared by Laser Ablation and DVD Template
The Binh Nguyen
Nhu Anh Nguyen
Gia Long Ngo
OriginalPaper 31 October 2019 Pages: 311 - 317
Theoretical Study on Factors Influencing the Efficiency of D–π′–A′–π–A Isoindigo-Based Sensitizer for Dye-Sensitized Solar Cells
Sarinya Hadsadee
Vinich Promarak
Siriporn Jungsuttiwong
OriginalPaper 07 November 2019 Pages: 318 - 332
Negative Differential Resistance (NDR) Behavior of Nickel Oxide (NiO) Based Metal-Insulator-Semiconductor Structures
Kamruzzaman Khan
Srikanth Itapu
Daniel G. Georgiev
OriginalPaper 18 November 2019 Pages: 333 - 340
Enhanced Charge Transport and Corrosion Protection Properties of Polyaniline–Carbon Nanotube Composite Coatings on Mild Steel
T. Rajyalakshmi
Apsar Pasha
Nacer Badi
OriginalPaper 12 November 2019 Pages: 341 - 352
Wafer Flatness Modeling in Chemical Mechanical Polishing
Chaoyue Zhao
Jianyong Li
Jianguo Cao
OriginalPaper 13 November 2019 Pages: 353 - 363
The Effect of SnO₂ and ZnO on the Performance of Perovskite Solar Cells
Elham Karimi
Seyed Mohamad Bagher Ghorashi
OriginalPaper 14 November 2019 Pages: 364 - 376
Investigation on Microstructural, Electrical and Optical Properties of Nd-Doped BaCo_0.01Ti_0.99O₃ Perovskite
K. Madhan
R. Murugaraj
OriginalPaper 29 October 2019 Pages: 377 - 384
Dual-Band Microwave Sensor for Investigation of Liquid Impurity Concentration Using a Metamaterial Complementary Split-Ring Resonator
Yogita Khanna
Y. K. Awasthi
OriginalPaper 04 November 2019 Pages: 385 - 394
Perylene Tetracarboxylic Diimide: Characterization and Its Role in the Electrical Properties of an Ag/N-BuHHPDI/PEDOT:PSS/p-Si Heterojunction Device
Muhammad Zeb
Muhammad Tahir
Fazal Wahab
OriginalPaper 11 October 2019 Pages: 395 - 401
The Aromatic Thermosetting Copolyester for Schottky Diode Applications in a Wide Temperature Range
İkram Orak
Zakir Caldiran
Adem Kocyigit
OriginalPaper 23 October 2019 Pages: 402 - 409
Effect of Annealing Treatment on Optical and Electrical Properties of PCDTBT:Graphene Hybrid Structure for Photovoltaic Application
Fatma Ben Slama Sweii
Rabeb Bkakri
Abdelaziz Bouazizi
OriginalPaper 29 October 2019 Pages: 410 - 418
Structural Characterization, Optical Absorption and Electrical Conduction in Ordered Defect Compound Cu₃In₅Se₉ of the Ternary Cu-In-Se Semiconductor System
G. Marín
D. P. Singh
L. Essaleh
OriginalPaper 18 November 2019 Pages: 419 - 428
Deep-Level Defect Effects on the Low-Temperature Photoexcitation Process in CdZnTe Crystals
Lingyan Xu
Wanqi Jie
OriginalPaper 23 October 2019 Pages: 429 - 434
Core-Double Shell Nano-hybrids Designed by Multi-walled Carbon Nanotubes, Polyaniline and Polythiophenes in PBDT-DTNT:PC61BM Solar Cells
As’ad Alizadeh
Samira Agbolaghi
OriginalPaper 11 October 2019 Pages: 435 - 443
Ultrasound-Assisted Method for Preparation of Ag₂S Nanostructures: Fabrication of Au/Ag₂S-PVA/n-Si Schottky Barrier Diode and Exploring Their Electrical Properties
Y. Badali
Y. Azizian-Kalandaragh
Ş. Altındal
OriginalPaper 12 November 2019 Pages: 444 - 453
Third Order Nonlinear Optical Properties of Piperazine Calcium Chloride (PCC) Crystal to Enhance the Optical Device Applications
R. U. Mullai
D. Sivavishnu
S. Vetrivel
OriginalPaper 16 October 2019 Pages: 454 - 463
Elastic and Thermodynamic Properties Prediction of Mg₂Sn and MgTe by First-Principle Calculation and Quasi-Harmonic Debye Model
Xin Li
Hui Xie
Shuangming Li
OriginalPaper 11 October 2019 Pages: 464 - 471
Impedance Spectroscopy and Conduction Behavior in CoFe₂O₄-BaTiO₃ Composites
S. Shankar
O. P. Thakur
M. Jayasimhadri
OriginalPaper 21 October 2019 Pages: 472 - 484
Preparation and Field Emission Properties of Single-Crystal CeB₆ Tips
Yixin Xiao
Xin Zhang
Jiuxing Zhang
OriginalPaper 22 October 2019 Pages: 485 - 492
p-GaN/n-ZnO Nanoplate/CsPbBr₃ Quantum Dots Heterojunction Light-Emitting Diode for Dual-Wavelength Emission
Chunxia Wu
Bisheng Yan
Jun Dai
OriginalPaper 30 October 2019 Pages: 493 - 498

Volume 49, Issue 1

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