TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder

ISSN: 0361-5235 (Print) 1543-186X (Online)

In this topical collection (22 articles)

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  1. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    The Effect of Ni and Bi Additions on the Solderability of Sn-0.7Cu Solder Coatings

    M. I. I. Ramli, M. A. A. Mohd Salleh, M. M. A. Abdullah… Pages 1-12

  2. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Low Temperature Cu-to-Cu Bonding in Non-vacuum Atmosphere with Thin Gold Capping on Highly (111) Oriented Nanotwinned Copper

    Yu-Ting Wu, Chih Chen Pages 13-17

  3. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Nanomechanical Responses of an Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium

    Jenn-Ming Song, Wei-Chih Lu, Pei-Wen Chou Pages 18-25

  4. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Effect of Chemical Additives in the Plating Bath on Surface Corrosion Resistance of Ni(P)

    C. Y. Wu, Y. H. Chen, Y. K. Tang, E. J. Lin, Y. X. Lin… Pages 26-33

  5. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Decomposed Copper(II) Acetate Over Expanded Graphite (EG) as Hybrid Filler to Fabricate Epoxy Based Thermal Interface Materials (TIMs)

    Sagar Kumar Nayak, Smita Mohanty, Sanjay K. Nayak Pages 34-47

  6. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards

    Won Sik Hong, Chulmin Oh Pages 48-58

  7. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Mechanical Reliability of Photovoltaic Cells under Cyclic Thermal Loading

    Dipali Sonawane, Praveen C. Ramamurthy, Praveen Kumar Pages 59-71

  8. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    A Study on Electrical and Electrochemical Characteristics of Friction Stir Welded Lithium-Ion Battery Tabs for Electric Vehicles

    Omkar Mypati, Debasish Mishra, Suryakanta Sahu… Pages 72-87

  9. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars

    H. Y. Yu, T. H. Yang, Y. S. Chiu, C. R. Kao Pages 88-95

  10. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films

    Nalla Somaiah, Praveen Kumar Pages 96-108

  11. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure

    I-Ju Wang, Ching-Shun Ku, Tu-Ngoc Lam, E-Wen Huang… Pages 109-115

  12. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys

    André M. Delhaise, Polina Snugovsky, Jeff Kennedy… Pages 116-127

  13. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature

    Shiqian Liu, Stuart McDonald, Qinfen Gu, Syo Matsumura… Pages 128-139

  14. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Orientation Relationships of Pure Tin on Single Crystal Germanium Substrates

    Thomas C. Reeve, Samuel Temple Reeve… Pages 140-151

  15. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties

    Paul T. Vianco, Bonnie B. McKenzie, Jerome A. Rejent… Pages 152-172

  16. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples

    Thiago Soares, Clarissa Cruz, Bismarck Silva… Pages 173-187

  17. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Low-Pressure Silver Sintering of Automobile Power Modules with a Silicon-Carbide Device and an Active-Metal-Brazed Substrate

    Won Sik Hong, Mi Song Kim, Chulmin Oh Pages 188-195

  18. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging

    Collin Fleshman, Jenq-Gong Duh Pages 196-201

  19. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields

    Yu Tian, Limin Ma, Yishu Wang, Fu Guo, Zhijie Sun Pages 202-211

  20. No Access

    TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Thermal, Electrical and Mechanical Properties of Expanded Graphite and Micro-SiC Filled Hybrid Epoxy Composite for Electronic Packaging Applications

    Sagar Kumar Nayak, Smita Mohanty, Sanjay K. Nayak Pages 212-225
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