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Volume 49, Issue 1
January 2020Special Section: TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder. Guest Editors: Kazuhiro Nogita, Tae-Kyu Lee, Zhi-Quan Liu, Arif Salleh, Christopher Gourlay, Yan Li, Albert T. Wu. Special Section: TMS2019 Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVIII. Guest Editor: Hiroshi Nishikawa
99 articles in this issue