1. Design, Test, Integration and Packaging of MEMS/MOEMS, 2004

   • Bernd Michel

   Editorial 29 October 2005 Pages: 1 - 1

2. Super-fine ink-jet printing: toward the minimal manufacturing system

   • Kazuhiro Murata
   • Junichi Matsumoto
   • Hiroshi Yokoyama

   Technical paper 11 October 2005 Pages: 2 - 7

   

3. Experimental measurements and behavioral modeling of an electrostatically actuated bi-axial micromirror

   • Fabien Parrain
   • Souhil Megherbi
   • Pierre Cusin

   Technical paper 28 October 2005 Pages: 8 - 14

   

4. V-shaped micromechanical tunable capacitors for RF applications

   • Aurélie Cruau
   • Gaëlle Lissorgues
   • Adrian M. Ionescu

   Technical paper 25 October 2005 Pages: 15 - 20

   

5. A methodology to extract dynamic compact thermal models under time-varying boundary conditions: application to a thermopile based IR sensor

   • M. Salleras
   • J. Palacín
   • S. Marco

   Technical paper 04 November 2005 Pages: 21 - 29

   

6. Fabrication and optimization of bimorph micro probes for the measurement of individual biocells

   • Y. H. Cho
   • D. Collard
   • B. J. Kim

   Technical paper 07 October 2005 Pages: 30 - 37

   

7. Behavioral VHDL-AMS model and experimental validation of a nuclear magnetic resonance sensor

   • S. Megherbi
   • J.-C. Ginefri
   • J.-F. Pône

   Technical paper 23 November 2005 Pages: 38 - 43

   

8. Electronic Mosquito: designing a semi-invasive Microsystem for blood sampling, analysis and drug delivery applications

   • Giorgio E. Gattiker
   • Karan V. I. S. Kaler
   • Martin P. Mintchev

   Technical paper 21 September 2005 Pages: 44 - 51

   

9. MOEMS: packaging and testing

   • Z. F. Wang
   • W. Cao
   • Z. Lu

   Technical paper 11 October 2005 Pages: 52 - 58

   

10. Mechanical and electrical bonding between silicon wafer and glass wafer with etched channels containing metal tracks

    • S. Brida
    • S. Metivet
    • O. Stojanovic

    Technical paper 08 September 2005 Pages: 59 - 62

    

11. Glass frit bonding: an universal technology for wafer level encapsulation and packaging

    • Roy Knechtel

    Technical paper 18 October 2005 Pages: 63 - 68

    

12. The influence of package-induced stresses on moulded Hall sensors

    • Sebastian Fischer
    • Harald Beyer
    • Jürgen Wilde

    Technical paper 07 October 2005 Pages: 69 - 74

    

13. Thermo-mechanical analysis of advanced electronic packages in early system design

    • Johann-Peter Sommer
    • Olaf Wittler
    • Bernd Michel

    Technical paper 19 November 2005 Pages: 75 - 81

    

14. Fabrication of microlens array with graduated sags using UV proximity printing method

    • H. Yang
    • C.-K. Chao
    • C.-P. Lin

    Technical paper 17 November 2005 Pages: 82 - 90

    

15. Tunable Fabry-Perot surface micromachined interferometer-experiments and modeling

    • Raluca Müller
    • Dana Cristea
    • M. Kusko

    Technical paper 23 November 2005 Pages: 91 - 97

    

16. Fabrication of an accurately vertical sidewall for optical switch applications using deep RIE and photoresist spray coating

    • T. Ikehara
    • R. Maeda

    Technical paper 25 August 2005 Pages: 98 - 103

    

17. Simulation and fabrication for pin-to-plate microjoining by Nd:YAG laser

    • C. K. Chung
    • Y. C. Lin

    Technical paper 18 November 2005 Pages: 104 - 109

    

18. Large-scale hot embossing

    • M. Worgull
    • M. Heckele
    • W. K. Schomburg

    Technical paper 28 October 2005 Pages: 110 - 115

    

19. A study of integration of LIGA and M-EDM technology on the microinjection molding of ink-jet printers’ nozzle plates

    • Shi-Chang Tseng
    • Yi-Chern Chen
    • Bow-Yuen Shew

    Technical paper 25 August 2005 Pages: 116 - 119

    

20. Bio-MEMS fabricated artificial capillaries for tissue engineering

    • G. J. Wang
    • C. L. Chen
    • Y. L. Chiang

    Technical paper 29 September 2005 Pages: 120 - 127

    

21. A 3D-CAM system for quick prototyping and microfabrication using excimer laser micromachining

    • Emir Mutapcic
    • Pio Iovenitti
    • Jason P. Hayes

    Technical paper 07 September 2005 Pages: 128 - 136

    

22. Feature length-scale modeling of LPCVD and PECVD MEMS fabrication processes

    • Lawrence C. Musson
    • Pauline Ho
    • Rodney C. Schmidt

    Technical paper 07 September 2005 Pages: 137 - 142

    

23. Preparation of ferroelectric ceramics in a film structure and their photovoltaic properties

    • M. Ichiki
    • Y. Morikawa
    • R. Maeda

    Technical paper 25 August 2005 Pages: 143 - 148

    

24. Reliability study of AlTi/TiW on polysilicon contacts for high temperature sensors

    • A. Andrei
    • C. Malhaire
    • O. Legras

    Technical paper 22 September 2005 Pages: 149 - 153

    

25. Transient thermal characterisation of hot plates

    • Gy. Bognár
    • P. Fürjes
    • M. Rencz

    Technical paper 11 October 2005 Pages: 154 - 159

    

26. SOI-CMOS compatible low-power gas sensor using sputtered and drop-coated metal-oxide active layers

    • P. Ivanov
    • J. Laconte
    • X. Correig

    Technical paper 11 October 2005 Pages: 160 - 168

    

27. Stable SOI micromachined electrostatic AC voltage reference

    • Anu Kärkkäinen
    • Panu Pekko
    • Heikki Seppä

    Technical paper 11 October 2005 Pages: 169 - 172

    

28. Integrated electromagnetic microactuators with a large driving force

    • C.-T. Pan
    • H. Yang
    • S.-C. Shen

    Technical paper 29 September 2005 Pages: 173 - 179

    

29. Development of a low cost hybrid Si/PDMS multi-layered pneumatic microvalve

    • Gaël Thuillier
    • Chantal Khan Malek

    Technical paper 11 October 2005 Pages: 180 - 185