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MOEMS: packaging and testing

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Abstract

In this paper, packaging techniques of fiber optical MEMS devices are investigated. A packaging scheme is proposed, which includes the architecture to construct the component package and the major packaging flow to implement it. Passive fiber alignment with the accuracy comparable with active alignment is presented by the combination of rectangular shape fiber grooves and micro fiber stoppers. The experimental setup specific for fiber optic MEMS component is presented for the fiber assembly and the characterization of optical loss. A testing system based on the Labview 6.1 instrument control is also presented, which can facilitate the characterization of switching time for MEMS optical switches.

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References

  • Generic requirements for singlemode fiber optic switches (2001) Telcordia Technologies GR-1073-core

  • Jin YF, Wang ZF, Wang ZP (2002) A study on hermetic packaging for micro-optical switch. Proceedings of IEEE 4th electronics packaging technology conference, Singapore, 2002, pp 96–100

  • TIA/EIA standard (1995) Interconnection device insertion loss test, TIA/EIA-455-34A

  • TIA/EIA standard (1999) Determination of component reflectance or link/system return loss using a loss test set, TIA/EIA-455-107A

  • Wang ZF, Shan XC, Wang ZP, et al (2002) Development of a new 1×4 optical switch. In: Proceedings of DTIP, Cannes, SPIE Vol. 4755, pp 544–548

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Acknowledgement

The authors would like to thank the staff at Sensors, actuators, and Microsystems Laboratory (SAMLAB), Institute of Microtechnology, University of Neuchâtel, Switzerland, for their technical support and the microfabrication of optical MEMS devices. The project was funded by the Agency for Science, Technology and Research (A*STAR), Singapore.

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Authors and Affiliations

  1. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore

    Z. F. Wang & W. Cao

  2. National University of Singapore, Singapore, Singapore

    Z. Lu

Authors
  1. Z. F. Wang
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  2. W. Cao
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  3. Z. Lu
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Corresponding author

Correspondence to Z. F. Wang.

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Wang, Z.F., Cao, W. & Lu, Z. MOEMS: packaging and testing. Microsyst Technol 12, 52–58 (2005). https://doi.org/10.1007/s00542-005-0018-6

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  • DOI: https://doi.org/10.1007/s00542-005-0018-6

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