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The influence of package-induced stresses on moulded Hall sensors

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Abstract

The output signals of moulded Hall sensors show changes in offset and sensitivity when the devices are affected by changing temperatures. This behaviour is a result of the differences in the thermal expansion behaviour of the package materials and is also affected by their time-dependent, viscous material properties. The stresses affected to the sensor’s sensitive layer will become effective via the piezo-Hall-effect as well as via piezo-resistivity which both change the sensitivity and the offset of the sensor’s output voltage. For modelling the stress in the sensitive area correctly it is indispensable to consider the visco-elastic and the visco-plastic behaviour of the materials constituting the package. Especially for very accurate sensors or components operating in harsh environments these effects must be regarded. In this work we investigate the thermo-mechanical stresses, which are induced in the sensitive layer of a moulded Hall sensor during the assembly process, the investigations were based mainly on finite-elements-simulations.

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Authors and Affiliations

  1. IMTEK, University of Freiburg, Freiburg, Germany

    Sebastian Fischer & Jürgen Wilde

  2. Micronas GmbH, Freiburg, Germany

    Harald Beyer & Ralf Janke

Authors
  1. Sebastian Fischer
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  2. Harald Beyer
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  3. Ralf Janke
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  4. Jürgen Wilde
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Correspondence to Sebastian Fischer.

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Fischer, S., Beyer, H., Janke, R. et al. The influence of package-induced stresses on moulded Hall sensors. Microsyst Technol 12, 69–74 (2005). https://doi.org/10.1007/s00542-005-0019-5

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  • DOI: https://doi.org/10.1007/s00542-005-0019-5

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