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Dependable Embedded Systems

  • Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems

  • Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers

  • Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Part of the book series: Embedded Systems (EMSY)

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Table of contents (25 chapters)

  1. Front Matter

    Pages i-xiii
  2. RAP Model—Enabling Cross-Layer Analysis and Optimization for System-on-Chip Resilience

    • Andreas Herkersdorf, Michael Engel, Michael Glaß, Jörg Henkel, Veit B. Kleeberger, Johannes M. Kühn et al.
    Pages 1-27Open Access
  3. Part I

    1. Front Matter

      Pages 29-31
    2. Soft Error Handling for Embedded Systems using Compiler-OS Interaction

      • Michael Engel, Peter Marwedel
      Pages 33-55Open Access
    3. ASTEROID and the Replica-Aware Co-scheduling for Mixed-Criticality

      • Eberle A. Rambo, Rolf Ernst
      Pages 57-84Open Access
    4. Dependability Aspects in Configurable Embedded Operating Systems

      • Horst Schirmeier, Christoph Borchert, Martin Hoffmann, Christian Dietrich, Arthur Martens, Rüdiger Kapitza et al.
      Pages 85-116Open Access
  4. Part II

    1. Front Matter

      Pages 117-119
    2. Increasing Reliability Using Adaptive Cross-Layer Techniques in DRPs: Just-Safe-Enough Responses to Reliability Threats

      • Johannes Maximilian Kühn, Oliver Bringmann, Wolfgang Rosenstiel
      Pages 121-138Open Access
    3. Dependable Software Generation and Execution on Embedded Systems

      • Florian Kriebel, Kuan-Hsun Chen, Semeen Rehman, Jörg Henkel, Jian-Jia Chen, Muhammad Shafique
      Pages 139-160Open Access
    4. Fault-Tolerant Computing with Heterogeneous Hardening Modes

      • Florian Kriebel, Faiq Khalid, Bharath Srinivas Prabakaran, Semeen Rehman, Muhammad Shafique
      Pages 161-180Open Access
    5. Thermal Management and Communication Virtualization for Reliability Optimization in MPSoCs

      • Victor M. van Santen, Hussam Amrouch, Thomas Wild, Jörg Henkel, Andreas Herkersdorf
      Pages 181-205Open Access
    6. Lightweight Software-Defined Error Correction for Memories

      • Irina Alam, Lara Dolecek, Puneet Gupta
      Pages 207-232Open Access
    7. Resource Management for Improving Overall Reliability of Multi-Processor Systems-on-Chip

      • Yue Ma, Junlong Zhou, Thidapat Chantem, Robert P. Dick, X. Sharon Hu
      Pages 233-246Open Access
  5. Part III

    1. Front Matter

      Pages 247-248
    2. Cross-Layer Resilience Against Soft Errors: Key Insights

      • Daniel Mueller-Gritschneder, Eric Cheng, Uzair Sharif, Veit Kleeberger, Pradip Bose, Subhasish Mitra et al.
      Pages 249-275Open Access
    3. Online Test Strategies and Optimizations for Reliable Reconfigurable Architectures

      • Lars Bauer, Hongyan Zhang, Michael A. Kochte, Eric Schneider, Hans-Joachim Wunderlich, Jörg Henkel
      Pages 277-302Open Access
    4. Reliability Analysis and Mitigation of Near-Threshold Voltage (NTC) Caches

      • Anteneh Gebregiorgis, Rajendra Bishnoi, Mehdi B. Tahoori
      Pages 303-334Open Access
  6. Part IV

    1. Front Matter

      Pages 335-336
    2. Selective Flip-Flop Optimization for Circuit Reliability

      • Mohammad Saber Golanbari, Mojtaba Ebrahimi, Saman Kiamehr, Mehdi B. Tahoori
      Pages 337-364Open Access
    3. EM Lifetime Constrained Optimization for Multi-Segment Power Grid Networks

      • Han Zhou, Zeyu Sun, Sheriff Sadiqbatcha, Sheldon X.-D. Tan
      Pages 365-383Open Access

About this book

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc.

  • Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems;
  • Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers;
  • Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.

Editors and Affiliations

  • Karlsruhe Institute of Technology, Karlsruhe, Germany

    Jörg Henkel

  • Computer Science, University of California, Irvine, Irvine, USA

    Nikil Dutt

About the editors

Prof. Jörg Henkel is with Karlsruhe Institute of Technology (KIT), Germany, where he is directing the Chair for Embedded Systems CES. Before, he was a Senior Research Staff Member at NEC Laboratories in Princeton, NJ. He received his PhD from Braunschweig University with "Summa cum Laude". Prof. Henkel has/is organizing various embedded systems and low power ACM/IEEE conferences/symposia as General Chair and Program Chair and was a Guest Editor on these topics in various Journals like the IEEE Computer Magazine. He was Program Chair of CODES'01, RSP'02, ISLPED’06, SIPS'08, CASES'09, Estimedia'11, VLSI Design'12, ICCAD’12, PATMOS’13, NOCS’14 and served as General Chair for CODES'02, ISLPED’09, Estimedia’12, ICCAD’13 and ESWeek'16. He is/has been a steering committee member of major conferences in the embedded systems field like at ICCAD, ESWeek, ISLPED, Codes+ISSS, CASES and is/has been an editorial board member of various journals like the IEEE TVLSI, IEEE TCAD, IEEE TMSCS, ACM TCPS, JOLPE etc.

 

In recent years, Prof. Henkel has given more than ten keynotes at various international conferences primarily with focus on embedded systems dependability. He has given full/half-day tutorials at leading conferences like DAC, ICCAD, DATE etc. Prof. Henkel received the 2008 DATE Best Paper Award, the 2009 IEEE/ACM William J. Mc Calla ICCAD Best Paper Award, the Codes+ISSS 2015, 2014, and 2011 Best Paper Awards, and the MaXentric Technologies AHS 2011 Best Paper Award as well as the DATE 2013 Best IP Award and the DAC 2014 Designer Track Best Poster Award. He is the Chairman of the IEEE Computer Society, Germany Section, and was the Editor-in-Chief of the ACM Transactions on Embedded Computing Systems (ACM TECS) for two consecutive terms. He is an initiator and the coordinator of the German Research Foundation's (DFG) program on 'Dependable Embedded Systems' (SPP 1500). He is the site coordinator (Karlsruhe site) of the Three-University Collaborative Research Center on "Invasive Computing" (DFG TR89). He is the Editor-in-Chief of the IEEE Design&Test Magazine. He holds ten US patents and is a Fellow of the IEEE.

Bibliographic Information

  • Book Title: Dependable Embedded Systems

  • Editors: Jörg Henkel, Nikil Dutt

  • Series Title: Embedded Systems

  • DOI: https://doi.org/10.1007/978-3-030-52017-5

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: The Editor(s) (if applicable) and The Author(s) 2021

  • License: CC BY

  • Hardcover ISBN: 978-3-030-52016-8Published: 10 December 2020

  • Softcover ISBN: 978-3-030-52019-9Published: 02 February 2022

  • eBook ISBN: 978-3-030-52017-5Published: 09 December 2020

  • Series ISSN: 2193-0155

  • Series E-ISSN: 2193-0163

  • Edition Number: 1

  • Number of Pages: XIII, 608

  • Number of Illustrations: 43 b/w illustrations, 250 illustrations in colour

  • Topics: Circuits and Systems, Cyber-physical systems, IoT, Processor Architectures

Buy it now

Buying options

Hardcover Book USD 59.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access