1. Cu₂ZnSnS₄ thin-film solar cell absorbers illuminated by soft x-rays

   • M. Bär
   • B.-A. Schubert
   • H.-W. Schock

   Invited Feature Paper 01 April 2012 Pages: 1097 - 1104

   

2. Pressure-induced metallic phase transition and elastic properties of indium phosphide III-V semiconductor

   • Chenghua Hu
   • Feng Wang
   • Zhou Zheng

   Article 01 April 2012 Pages: 1105 - 1111

   

3. Effects of different sulfurization conditions on the characterization of CuIn(S_xSe_1−x)₂ thin films

   • Fei Yan
   • Weifeng Liu
   • Changfei Zhu

   Article 01 April 2012 Pages: 1112 - 1116

   

4. Control of the morphology and chemical properties of carbon spheres prepared from glucose by a hydrothermal method

   • Min Li
   • Wei Li
   • Shouxin Liu

   Article 01 April 2012 Pages: 1117 - 1123

   

5. Molecular dynamics study on the microstructure of dendrimers/graphite composites

   • Ruibin Guo
   • Weiwei Han
   • Chao Feng

   Article 01 April 2012 Pages: 1124 - 1130

   

6. Effects of Sn grain structure on the electromigration of Sn−Ag solder joints

   • Yiwei Wang
   • Kuan H. Lu
   • Paul S. Ho

   Article 01 April 2012 Pages: 1131 - 1141

   

7. Diffusion of Cu and interfacial reactions during reflow of Sn−8.5Zn−0.5Ag−0.01Al−0.1Ga alloy on Ni/Cu substrate

   • Jagjiwan Mittal
   • Kwang Lung Lin

   Article 01 April 2012 Pages: 1142 - 1148

   

8. Development of a Bi₂Te₃-based thermoelectric generator with high-aspect ratio, free-standing legs

   • D. E. Wesolowski
   • R. S. Goeke
   • C. A. Apblett

   Article 01 April 2012 Pages: 1149 - 1156

   

9. Oscillatory thickness dependences of the Seebeck coefficient in nanostructures based on compounds IV–VI

   • Dmytro M. Freik
   • Igor K. Yurchyshyn
   • Yuriy V. Lysiuk

   Article 01 April 2012 Pages: 1157 - 1163

   

10. Investigation on the atomic structural evolution of as-prepared and annealed ZrCuAl metallic glasses

    • Liang Yang
    • Cai-Long Huang
    • Gu-Qing Guo

    Article 01 April 2012 Pages: 1164 - 1168

    

11. Kinetic study of the intermetallic compound formation between eutectic Sn−3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints

    • Hsiao-Yun Chen
    • Chih Chen

    Article 01 April 2012 Pages: 1169 - 1177

    

12. Oxidation resistance of the supercooled liquid in Cu₅₀Zr₅₀ and Cu₄₆Zr₄₆Al₈ metallic glasses

    • Ka Ram Lim
    • Won Tae Kim
    • Jurgen Eckert

    Article 01 April 2012 Pages: 1178 - 1186

    

13. Abrasive waterjet machining of three-dimensional structures from bulk metallic glasses and comparison with other techniques

    • Victor Wessels
    • Anton Grigoryev
    • Jörg F. Löffler

    Article 01 April 2012 Pages: 1187 - 1192

    

14. Neck formation in reactive sintering: A model 2-D experiment

    • Sukanya Murali
    • Dunbar P. Birnie III

    Article 01 April 2012 Pages: 1193 - 1197

    

15. A Q-DLTS investigation of aluminum nitride surface termination

    • Jason B. Rothenberger
    • Daniel E. Montenegro
    • Sudarshan K. Loyalka

    Article 01 April 2012 Pages: 1198 - 1204

    

16. Comment to paper “Penetration depth and tip radius dependence on the correction factor in nanoindentation measurements” by J.M. Meza et al. [J. Mater. Res. 23(3), 725 (2008)]

    • Karsten Durst
    • Hamad ur Rehman
    • Benoit Merle

    Comments and Reply 01 April 2012 Pages: 1205 - 1207

    

17. A response to—“Comment on the evaluation of the constant β relating the contact stiffness to the contact area in nanoindentation for sphero-conical indenters:” Comment to paper “Penetration depth and tip radius dependence on the correction factor in nanoindentation measurements” by J.M. Meza et al. [J. Mater. Res. 23(3), 725 (2008)]

    • Juan Manuel Meza
    • Fazilay Abbes
    • Michel Troyon

    Letter 01 April 2012 Pages: 1208 - 1210