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Diffusion of Cu and interfacial reactions during reflow of Sn−8.5Zn−0.5Ag−0.01Al−0.1Ga alloy on Ni/Cu substrate

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Abstract

Reflow behavior of a Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga (five-element) solder on the Ni/Cu substrate was investigated under different heating rates. Reflowed samples show decreased Zn and increased AgZn3 in the solder with a reduction in the heating rate. The Zn at the solder/substrate interface was found to be much lower than that in the Sn–Zn solder systems. Cu was observed to be diffused through the electroplated Ni layer and noticed only with the Ag–Zn compound in the solder. Ga was spotted at the interface in the Ag–Zn matrix, whereas Al was detected with the Zn at the interface. Small intermetallic compound (IMC) layer was formed at the interface; however, its amount enhanced with the reduction in the heating rate. Present study relates the reflow behavior of the five-element solder with the reactivity of different elements in the system and its influence on the formation of IMCs in the solder and at the solder/substrate interface.

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ACKNOWLEDGMENTS

The support of this study by the National Science Council (NSC) of the Republic of China (Taiwan) under Grant NSC98-2211-E-006-MY3 is gratefully acknowledged. One of authors (J. Mittal) is grateful to NSC for his financial support during the course of this work under Grant NSC98-2811-E-006-059.

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  1. Department of Material Science and Engineering, National Cheng Kung University, Tainan, 701, Taiwan, Republic of China

    Jagjiwan Mittal & Kwang Lung Lin

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  1. Jagjiwan Mittal
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Mittal, J., Lin, K.L. Diffusion of Cu and interfacial reactions during reflow of Sn−8.5Zn−0.5Ag−0.01Al−0.1Ga alloy on Ni/Cu substrate. Journal of Materials Research 27, 1142–1148 (2012). https://doi.org/10.1557/jmr.2012.68

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