Passivation of Interfacial States for GaAs- and InGaAs/InP-Based Regrown Nanostructures M. K. RathiG. TsvidT. F. Kuech OriginalPaper 22 July 2009 Pages: 2023 - 2032
Thermodynamic Descriptions for the Cd-Te, Pb-Te, Cd-Pb and Cd-Pb-Te Systems Yajun LiuLijun ZhangDi Yu OriginalPaper 10 July 2009 Pages: 2033 - 2045
Effect of Colloidal Silver on Optical Transmittance Characteristics of Bulk Cadmium Zinc Telluride Crystals R. RamanAshok Kumar KapoorAkhilesh Pandey OriginalPaper 07 July 2009 Pages: 2046 - 2051
On the Mechanisms Governing Aluminum-Mediated Solid-Phase Epitaxy of Silicon Yann CivaleGuglielmo VastolaJae-Ryoung Kim OriginalPaper Open access 07 July 2009 Pages: 2052 - 2062
Thermal Stability of Ge2Sb2Te5 in Contact with Ti and TiN Vijayaharan A. VenugopalGiampiero OttavianiEnrico Varesi OriginalPaper 25 June 2009 Pages: 2063 - 2068
Rheological Behavior of Thermal Interface Pastes Chuangang LinD. D. L. Chung OriginalPaper 10 July 2009 Pages: 2069 - 2084
In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples Dominik HerkommerMichael ReidJeff Punch OriginalPaper 07 July 2009 Pages: 2085 - 2095
Experimental Investigation and Thermodynamic Assessment of Phase Equilibria in the Ag-Au-Sn System F. GaoC.P. WangK. Ishida OriginalPaper 08 July 2009 Pages: 2096 - 2105
Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures Pin J. WangJong S. KimChin C. Lee OriginalPaper Open access 07 July 2009 Pages: 2106 - 2111
Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions Hwa-Teng LeeChoo-Yeow LeeYang-Hsien Lee OriginalPaper 09 July 2009 Pages: 2112 - 2121
A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques V. SivasubramaniamM. GalliJ. Botsis OriginalPaper 07 July 2009 Pages: 2122 - 2131
Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions Ning ZhangYaowu ShiXiaoyan Li OriginalPaper 07 July 2009 Pages: 2132 - 2147
Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder Hwa-Teng LeeYin-Fa Chen OriginalPaper 26 June 2009 Pages: 2148 - 2157
Thermodynamic Assessment of the Au-Co-Sn Ternary System H. Q. DongS. JinZ. P. Jin OriginalPaper 01 July 2009 Pages: 2158 - 2169
Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water Hong ChangHongtao ChenYonggao Fu OriginalPaper 30 June 2009 Pages: 2170 - 2178
Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints L.M. YinX.P. ZhangChunsheng Lu BriefCommunication 25 June 2009 Pages: 2179 - 2183
Study of DC and AC Electromigration Behavior in Eutectic Pb-Sn Solder Joints W. H. WuS. P. PengC. E. Ho OriginalPaper 19 June 2009 Pages: 2184 - 2193
Abnormal Failure Behavior of Sn-3.5Ag Solder Bumps Under Excessive Electric Current Stressing Conditions Jang-Hee LeeYoung-Bae Park OriginalPaper 18 June 2009 Pages: 2194 - 2200
A Numerical Simulation of Nanostructure Formation Utilizing Electromigration Kazuhiko SasagawaShota FukushiMasumi Saka BriefCommunication 18 June 2009 Pages: 2201 - 2206
Water-Induced Degradation in (Bi1/2Na1/2)TiO3 Lead-Free Ceramics Y. H. GuW. P. ChenH. L. W. Chan OriginalPaper 21 July 2009 Pages: 2207 - 2210