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Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions

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Abstract

This study was concerned with the effect of thermal aging on the impact properties of solder joints. Three kinds of solders, conventional Sn-37Pb solder, Sn-3.8Ag-0.7Cu solder, and Sn-3.8Ag-0.7Cu doped with rare-earth (RE) elements, were selected to manufacture joint specimens for the Charpy impact test. U-notch specimens were adopted and isothermally aged at 150°C for 100 h and 1000 h, and then impacted by using a pendulum-type impact tester at room temperature. The Sn-37Pb solder joints exhibited higher performance in terms of impact absorbed energy in the as-soldered and 100 h thermally aged conditions. Interestingly, the Sn-3.8Ag-0.7Cu solder joints exhibited improved performance for the impact value after 1000 h of thermal aging. For the Sn-37Pb and Sn-3.8Ag-0.7Cu solder joints, the impact absorbed energies initially increased when the storage duration was limited to 100 h, and then gradually decreased with its further increase. For the Sn-3.8Ag-0.7Cu-RE specimens, impact performance decreased directly with increasing thermal aging. Furthermore, scanning electron microscopy (SEM) observation showed that the fracture paths were focused on the interface zone for the three kinds of joints in the aged conditions. For the Sn-37Pb joints, the fracture surfaces mainly presented a ductile fracture mode. For the Sn-3.8Ag-0.7Cu joints, with microstructure coarsening, crack propagation partly shifted towards the Sn/Cu6Sn5 interface. Compared with the 100 h aged joints, the area fraction of intergranular fracture of Sn grains on the Sn-3.8Ag-0.7Cu fracture surfaces was increased when the aging time was 1000 h. On the contrary, the fracture morphologies of Sn-3.8Ag-0.7Cu-RE were mainly brittle as thermal aging increased. Thus, an interrelationship between impact energy value and fracture morphology was observed.

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References

  1. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K.N. Tu, Scripta Mater. 51, 641 (2004).

    Article  CAS  Google Scholar 

  2. C.M. Kumar, Internal Report. Intel Corporation (2006).

  3. D.Y.R. Chong, F.X. Che, J.H.L. Pang, K. Ng, J.Y.N. Tan, and P.T.H. Low, Microelectron. Reliab. 46, 160 (2006).

    Article  Google Scholar 

  4. L. Garner, S. Sane, D. Suh, T. Byrne, A. Dani, T. Martin, M.␣Mello, M. Patel, and R. Williams, Intel. Tech. J. 9, 297 (2005).

    Google Scholar 

  5. Y.-S. Lai, P.-F. Yang, and C.-L. Yeh, Microelectron. Reliab. 46, 645 (2006).

    Article  CAS  Google Scholar 

  6. Z. Chen, M. He, A. Kumar, and G.J. Qi, J. Electron. Mater. 36, 17 (2007).

    Article  ADS  Google Scholar 

  7. K. Zeng, R. Stierman, T.C. Chiu, D. Edwards, K. Ano, and K.N. Tu, J. Appl. Phys. 97, 024508 (2005).

    Article  ADS  Google Scholar 

  8. P.T. Vianco, J.A. Rejent, and P. Hlava, J. Electron. Mater. 33, 991 (2004).

    Article  ADS  CAS  Google Scholar 

  9. M. Date and K.N. Tu, J. Mater. Res. 19, 2887 (2004).

    Article  ADS  CAS  Google Scholar 

  10. C.E. Ho, R.Y. Tsai, Y.L. Lin, and C.R. Kao, J. Electron. Mater. 31, 587 (2002).

    ADS  Google Scholar 

  11. X. Deng, N. Chawla, K.K. Chawla, and M. Koopman, Acta Mater. 52, 4291 (2004).

    Article  CAS  Google Scholar 

  12. E.F. De Monlevade and W. Peng, J. Electron. Mater. 36, 783 (2007).

    Article  ADS  CAS  Google Scholar 

  13. W. Peng and M.E. Marques, J. Electron. Mater. 36, 1679 (2007).

    Article  ADS  CAS  Google Scholar 

  14. J.J. Sundelin, S.T. Nurmi, T.K. Lepistö, and E.O. Ristolainen, Mater. Sci. Eng. A 420, 55 (2006).

    Article  Google Scholar 

  15. H.-T. Lee, M.-H. Chen, H.-M. Jao, and T.-L. Liao, Mater. Sci. Eng. A 358, 134 (2003).

    Article  Google Scholar 

  16. I.E. Anderson, J. Mater. Sci.: Mater. Electron. 18, 55 (2007).

    Article  CAS  Google Scholar 

  17. N. Zhang, Y. Shi, Z. Xia, Y. Lei, F. Guo, and X. Li, J. Electron. Mater. 37, 1631 (2008).

    Article  ADS  Google Scholar 

  18. Z. Mei, A.J. Sunwoo, and J.W. Morris Jr., Metall. Mater. Trans. A 23A, 857 (1992).

    ADS  CAS  Google Scholar 

  19. L. Xu, J.H.L. Pang, and F. Che, J. Electron. Mater. 37, 880 (2008).

    Article  ADS  CAS  Google Scholar 

  20. J.-W. Jang, A.P. De Silva, J.E. Drye, S.L. Post, N.L. Owens, J.-K. Lin, and D.R. Frear, IEEE Trans. Electron. Pack. 30, 49 (2007).

    Article  CAS  Google Scholar 

  21. E.H. Wong, S.K.W. Seah, W.D. van Driel, J.F.J.M. Caers, N. Owens, and Y.-S. Lai, Microelectron. Reliab. 49, 139 (2009).

    Article  CAS  Google Scholar 

  22. D. Suh, D.W. Kim, P. Liu, H. Kim, J.A. Weninger, C.M. Kumar, A. Prasad, B.W. Grimsley, and H.B. Tejada, Mater. Sci. Eng. A 460–461, 595 (2007).

    Google Scholar 

  23. Y.W. Shi, J.T. Barnby, and A.S. Nadkarni, Eng. Fract. Mech. 39, 37 (1991).

    Article  Google Scholar 

  24. R.J. Fields and S.R. Low, Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in Solder Joints. Metallurgy Division of National Institute of Standards and Technology (NIST), USA, Technical paper (2001).

  25. C.M.L. Wu and Y.W. Wong, J. Mater. Sci.: Mater. Electron. 18, 77 (2007).

    Article  CAS  Google Scholar 

  26. M. Abtew and G. Selvaduray, Mater. Sci. Eng. R 27, 95 (2000).

    Article  Google Scholar 

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Authors and Affiliations

  1. College of Material Science and Engineering, Beijing University of Technology, 100 Pingleyuan, Chaoyang District, Beijing, 100124, People’s Republic of China

    Ning Zhang, Yaowu Shi, Yongping Lei, Zhidong Xia, Fu Guo & Xiaoyan Li

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  1. Ning Zhang
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  2. Yaowu Shi
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  3. Yongping Lei
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  4. Zhidong Xia
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  5. Fu Guo
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  6. Xiaoyan Li
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Correspondence to Ning Zhang.

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Zhang, N., Shi, Y., Lei, Y. et al. Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions. J. Electron. Mater. 38, 2132–2147 (2009). https://doi.org/10.1007/s11664-009-0872-6

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  • DOI: https://doi.org/10.1007/s11664-009-0872-6

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