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In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples

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Abstract

In this paper the creep behavior of lead-free 96.5Sn-3.0Ag-0.5Cu solder is evaluated. A series of creep tests at different stress/temperature and strain rate/temperature pairs has been conducted. The tests were observed in situ with a high-magnification camera system. Optical observation results are presented from selected tests, showing the occurrence of surface effects such as shear bands, voiding, and rumpling. From these observations the main deformation mechanisms were derived and compiled in terms of their dependence on the test conditions.

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Acknowledgements

The authors acknowledge the financial support of Science Foundation Ireland under Grant Number 03/CE3/I405.

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Authors and Affiliations

  1. CTVR, Stokes Institute, University of Limerick, Limerick, Ireland

    Dominik Herkommer, Michael Reid & Jeff Punch

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  1. Dominik Herkommer
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  2. Michael Reid
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  3. Jeff Punch
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Correspondence to Michael Reid.

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Herkommer, D., Reid, M. & Punch, J. In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples. J. Electron. Mater. 38, 2085–2095 (2009). https://doi.org/10.1007/s11664-009-0885-1

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  • DOI: https://doi.org/10.1007/s11664-009-0885-1

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