Advertisement

Three Dimensional System Integration

IC Stacking Process and Design

  • Antonis Papanikolaou
  • Dimitrios Soudris
  • Riko Radojcic

Table of contents

  1. Front Matter
    Pages i-viii
  2. Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
    Pages 1-12
  3. James Burns
    Pages 13-32
  4. Michele Stucchi, Guruprasad Katti, Dimitrios Velenis
    Pages 33-49
  5. Robert Patti
    Pages 51-71
  6. Jason Cong, Guojie Luo
    Pages 73-100
  7. Young-Joon Lee, Michael Healy, Sung Kyu Lim
    Pages 103-136
  8. Dragomir Milojevic, Ravi Varadarajan, Dirk Seynhaeve, Pol Marchal
    Pages 137-185
  9. Trevor Carlson, Marco Facchini
    Pages 187-210
  10. Back Matter
    Pages 243-246

About this book

Introduction

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing.

Keywords

3D Chip Stacking 3D Integrated Circuit Design and Manufacturing 3D Integrated Circuits 3D Stacked Integrated Circuits 3D System Integration Contactless 3D Coupling DRAM Stacking Logic Stacking TSV Through-Silicon Vias

Editors and affiliations

  • Antonis Papanikolaou
    • 1
  • Dimitrios Soudris
    • 2
  • Riko Radojcic
    • 3
  1. 1., Dept. of Electrical and Computer EngineeNational Technical University of AthensAthensGreece
  2. 2.Dept. Electrical & Computer EngineeringNational Technical University of AthensAthensGreece
  3. 3.San DiegoUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-0962-6
  • Copyright Information Springer Science+Business Media, LLC 2011
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-0961-9
  • Online ISBN 978-1-4419-0962-6
  • Buy this book on publisher's site