Microprocessor Design Using 3D Integration Technology

  • Yuan Xie


Previous chapters have described various aspects of 3D integration technology, including the fundamentals of process technology and EDA design flows for 3D IC design. In this chapter, we discuss how to leverage the emerging 3D integration technology for future microprocessor design.


Device Layer SRAM Cell Issue Width Selection Logic Sense Amplifier 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



Much of the work and ideas presented on this chapter have evolved over several years in work with our colleagues and graduate students at Penn State, in particular Professor Vijaykrishnan Narayanan, Professor Mary Jane Irwin, Yuh-Fang Tsai, Wei-lun Hung, and Xiangyu Dong.


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Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  • Yuan Xie
    • 1
  1. 1.Department of Computer Science and EngineeringPennsylvania State UniversityUniversity ParkUSA

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