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Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs

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Three Dimensional System Integration

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Abstract

Historically, advances in the field of packaging and system integration have not progressed at the same rate as ICs. In fact, today’s silicon ancillary technologies have truly become a limiter to the performance gains possible from advances in semiconductor manufacturing, especially due to cooling, power delivery, and ­signaling [1, 2]. Today, it is widely accepted that three-dimensional (3D) system integration is a key enabling technology and has recently gained significant momentum in the semiconductor industry. Three-dimensional integration may be used either to partition a single chip into multiple strata to reduce on-chip global interconnect lengths [3] and/or used to stack chips that are homogeneous or heterogeneous. AQ: Please check if the inserted citation of Fig. 6.1 is appropriate.

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Notes

  1. 1.

    These silicon ancillary technologies continue to advance, and the size of the related interconnects and TSVs continues to scale down. Our study will be helpful in evaluating these advances in the context of full layout and routing environment.

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Authors and Affiliations

  1. School of Electrical and Computer Engineering, Georgia Institute of Technology, 777 Atlantic Drive NW, Atlanta, 30332-0250, GA, USA

    Sung Kyu Lim

Authors
  1. Young-Joon Lee
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  2. Michael Healy
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  3. Sung Kyu Lim
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Correspondence to Sung Kyu Lim .

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Editors and Affiliations

  1. , Dept. of Electrical and Computer Enginee, National Technical University of Athens, Heroon Polytechneiou 9, Athens, 157 80, Greece

    Antonis Papanikolaou

  2. Dept. Electrical & Computer Engineering, National Technical University of Athens, Heroon Polytechneiou 9, Athens, 157 80, Greece

    Dimitrios Soudris

  3. San Diego, California, USA

    Riko Radojcic

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Lee, YJ., Healy, M., Lim, S.K. (2011). Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs. In: Papanikolaou, A., Soudris, D., Radojcic, R. (eds) Three Dimensional System Integration. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-0962-6_6

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  • DOI: https://doi.org/10.1007/978-1-4419-0962-6_6

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  • Online ISBN: 978-1-4419-0962-6

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