TSV Characterization and Modeling

  • Michele Stucchi
  • Guruprasad Katti
  • Dimitrios Velenis


The through-silicon via (TSV) is composed of a conductor, also named “nail” or “plug,” crossing the Si substrate of the stacked dies [1, 2], as shown in Fig. 3.1. The conductor [common material choices include copper (Cu), tungsten (W), and polysilicon] is electrically insulated from the substrate by a dielectric layer (usually SiO2) and interconnects the metal wires of the stacked dies.


Depletion Region Substrate Contact Electric Field Line Insulator Capacitance Insulator Layer Thickness 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


  1. 1.
    Topol AW et al (2006) Three-dimensional integrated circuits. IBM J Res Dev 50(4/5):491–506CrossRefGoogle Scholar
  2. 2.
    Beyne E (2006) The rise of the 3rd dimension for system integration. In: Proceedings of international interconnect technology conference, Burlingame, CA, 5–7 June, pp 1–5Google Scholar
  3. 3.
    Pak JS, Ryu C, Kim J (2007) Electrical characterization of through silicon via (TSV) depending on structural and material parameters based on 3D full wave simulation. In: Proceedings of international conference on electronic materials and packaging, Daejeon, 19–22 November, pp 19–22Google Scholar
  4. 4.
    Van Olmen J et al (2008) 3D stacked IC demonstration using a through silicon via first approach. IEDM Technical Digest pp 603–606Google Scholar
  5. 5.
    Kamon M, Silveira L et al (1996) FastHenry USER’S GUIDE: version 3.0, Massachusetts Institute of Technology, November, Scholar
  6. 6.
    Raphael Interconnect Analysis Program Reference Manual (2007) Version A-2007.09, Synopsis Inc., Mountain View, CAGoogle Scholar
  7. 7.
    Stucchi M, Perry D. Katti G. Dehaene W (2010) Test structures for characterization of through silicon vias, IEEE International Conference on Microelectronic Test Structures (ICMTS)Google Scholar
  8. 8.
    Sze SM (1981) Physics of semiconductor devices. John Wiley & Sons, New YorkGoogle Scholar
  9. 9.
    Katti G et al (2010) Electrical Characterization & Modeling of Through Silicon Via (TSV) for 3D ICs, IEEE Transactions on Electron Devices, Volume 57, Issue 1; Jan, pp 256–262Google Scholar
  10. 10.
    Bandyopadhyay T, Chatterjee R, Chung D, Swaminanithan M, and Tummala R (2009) Electrical modeling of through silicon and package vias, IEEE Inter. Conf. 3D System Integration, Sep, pp 28–30Google Scholar
  11. 11.
    Sentaurus Device User Guide (2008) Version A-2008.09, Synopsis Inc., Mountain View, CAGoogle Scholar
  12. 12.
    Katti G, Stucchi M, Olmen JV, Meyer KD, and Dehaene W (2010) Through-silicon-via capacitance reduction technique to benefit 3-D IC performance, IEEE Electron Device Lett., vol. 31, no. 4, Jun, pp 549–551Google Scholar
  13. 13.
    Kikuchi H et al (2008) Tungsten through-silicon via technology for three-dimensional LSIs. Jpn J Appl Phys 47(4):2801–2806CrossRefGoogle Scholar
  14. 14.
    Pucel R (1985) Gallium arsenide technology, Technology and Design Considerations of Monolithic Microwave Integrated Circuits. In: Ferry D (ed) Howard W. Sams and Co., Indianapolis, IN, chapter 6, pp 216Google Scholar
  15. 15.
    Young B (2001) Digital signal integrity. Prentice Hall, New York, pp 45Google Scholar
  16. 16.
    Marchal P et al (2009) 3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot, Proceedings of the IEEE, Volume: 97, Issue: 1, pp 96–107Google Scholar
  17. 17.
    Katti G et al (2009) 3D Stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective Bonding, in IEDM Tech. Dig., pp 357–360Google Scholar
  18. 18.
    Rabaey J et al (2003) Digital integrated circuits, Upper Saddle River, New Jersey 07458, 2nd edn. Prentice Hall Electronics and VLSI SeriesGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  • Michele Stucchi
    • 1
  • Guruprasad Katti
  • Dimitrios Velenis
  1. 1.IMEC vzwLeuvenBelgium

Personalised recommendations