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TSV Characterization and Modeling

  • Michele Stucchi
  • Guruprasad Katti
  • Dimitrios Velenis
Chapter

Abstract

The through-silicon via (TSV) is composed of a conductor, also named “nail” or “plug,” crossing the Si substrate of the stacked dies [1, 2], as shown in Fig. 3.1. The conductor [common material choices include copper (Cu), tungsten (W), and polysilicon] is electrically insulated from the substrate by a dielectric layer (usually SiO2) and interconnects the metal wires of the stacked dies.

Keywords

Depletion Region Substrate Contact Electric Field Line Insulator Capacitance Insulator Layer Thickness 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  • Michele Stucchi
    • 1
  • Guruprasad Katti
  • Dimitrios Velenis
  1. 1.IMEC vzwLeuvenBelgium

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