Homogeneous 3D Integration



This chapter focuses on homogeneous 3D integration – that is, the vertical assembly of like materials or components – but also provides information about homogeneous 3D assemblies in combination with other 2D or 3D devices. One example of homogeneous integration is the stacking of memory layers to create a 3D memory device. In such a device, the component layers are usually made of the same material and are often virtually identical in design. This chapter uses 3D DRAM as a reference application.


Process Corner Mean Time Between Failure Speed Grade Test Insertion Memory Layer 
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Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  1. 1.Tezzaron SemiconductorNapervilleUSA

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