Volume 50, Issue 3 | Journal of Electronic Materials

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Volume 50, Issue 3

March 2021

Special Section: TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder. Guest Editors: Christopher M. Gourlay, Kazuhiro Nogita, David P. Yan, Mike Wolverton, Babak Arfaei, Andre M. Delhaise, Mehran Maalekian, Mohd Arif Salleh

90 articles in this issue

Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature
Chuantong Chen
Chanyang Choe
Katsuaki Suganuma
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 27 August 2020 Pages: 687 - 698
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Localized Multi-axis Loading Impact on Interconnect Thermal Cycling Performance in Via-in-Pad Plated Over (VIPPO) Board Configuration
Mohamed Sheikh
Andy Hsiao
Tae-Kyu Lee
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 27 August 2020 Pages: 699 - 709
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Origin of Primary Cu₆Sn₅ in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties
S. F. N. Muhd Amli
M. A. A. Mohd Salleh
K. Nogita
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 28 August 2020 Pages: 710 - 722
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Impact of Cryogenic Temperature Environment on Single Solder Joint Mechanical Shear Stability
Ande Kitamura
Timothy Matthews
Tae-Kyu Lee
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 15 September 2020 Pages: 723 - 734
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Whisker Growth in Sn Coatings: A Review of Current Status and Future Prospects
Piyush Jagtap
Praveen Kumar
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 22 September 2020 Pages: 735 - 766
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Role of Grain Boundary Sliding in Structural Integrity of Cu-Filled Through Si Via During Isothermal Annealing
Dipali Sonawane
Praveen Kumar
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 28 September 2020 Pages: 767 - 778
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure
Wei-Hao Chen
Chia-Yueh Chou
Cheng-Yi Liu
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 30 September 2020 Pages: 779 - 785
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Time-Lapse Imaging of Ag₃Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints
J. W. Xian
S. A. Belyakov
C. M. Gourlay
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder Open access 13 October 2020 Pages: 786 - 795
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Effect of Different Soldering Temperatures on the Solder Joints of Flip-Chip LED Chips
Xinmeng Zhai
Chengyu Guan
Yang Li
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 13 October 2020 Pages: 796 - 807
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls
A. A. Daszki
C. M. Gourlay
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder Open access 15 October 2020 Pages: 808 - 817
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures
V. Vuorinen
H. Dong
M. Paulasto-Kröckel
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder Open access 20 October 2020 Pages: 818 - 824
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony
S. A. Belyakov
R. J. Coyle
C. M. Gourlay
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder Open access 26 October 2020 Pages: 825 - 841
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Tin Whisker Growth on Electronic Assemblies Soldered with Bi-Containing, Pb-Free Alloys
André M. Delhaise
Zohreh Bagheri
Jeff Kennedy
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 27 October 2020 Pages: 842 - 854
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength
S. F. N. Muhd Amli
M. A. A. Mohd Salleh
K. Nogita
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 03 January 2021 Pages: 855 - 868
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints
Zhai Xinmeng
Li Yuefeng
Hu Rongrong
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 12 January 2021 Pages: 869 - 880
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Effect of Ni, Zn, Au, Sb and In on the Suppression of the Cu₃Sn Phase in Sn-10 wt.%Cu Alloys
Syeda U. Mehreen
Kazuhiro Nogita
David H. StJohn
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 19 January 2021 Pages: 881 - 892
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration
Marion Branch Kelly
Aravindha Antoniswamy
Nikhilesh Chawla
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 27 November 2020 Pages: 893 - 902
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples
Yu-Chun Li
Ching-Hsun Chang
Yee-Wen Yen
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 08 January 2021 Pages: 903 - 913
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Electrical and Microstructural Reliability of Pressureless Silver-Sintered Joints on Silicon Carbide Power Modules Under Thermal Cycling and High-Temperature Storage
Won Sik Hong
Mi Song Kim
Kyoung-Kook Hong
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder 11 January 2021 Pages: 914 - 925
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures
Tianhong Gu
Christopher M. Gourlay
T. Ben Britton
TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder Open access 16 January 2021 Pages: 926 - 938
Part of 1 collection:

TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Is Our Silver Corrosion Measurement Correct? Research Note
Michael Osterman
Robert Utter
Brief Communication 02 January 2021 Pages: 939 - 940
Electrical and Magnetic Properties for Bulk FeSe and FeSe_0.5Te_0.5 Superconductors
D. Li
B. L. Zhang
H. J. Liu
Brief Communication 03 January 2021 Pages: 941 - 946
Temperature Gradient-Dominated Electrical Behaviours in a Piezoelectric PN Junction
MingKai Guo
Chunsheng Lu
MingHao Zhao
Brief Communication 03 January 2021 Pages: 947 - 953
Hydrothermal Synthesis, Photocatalytic and Magnetic Properties of Pure-Phase Bi₂Fe₄O₉ Microstructures
S. M. Yin
W. Q. Li
Z. H. Ren
Original Research Article 09 November 2020 Pages: 954 - 959
Effect of N-rGO Decoration on the Structure and Optical Properties of WO₃ Nanoplates
Farzaneh Badiezadeh
Salimeh Kimiagar
Nasser Zare-Dehnavi
Original Research Article 20 November 2020 Pages: 960 - 967
Regulating the Structural, Transmittance, Ferroelectric, and Energy Storage Properties of K_0.5Na_0.5NbO₃ Ceramics Using Sr(Yb_0.5Nb_0.5)O₃
Gangbin Hu
Haonan Liu
Changrong Zhou
Original Research Article 22 November 2020 Pages: 968 - 977
Prediction of Magnetocaloric Effects of La_0.7Sr_0.3Mn_1-xCu_xO₃ Compounds (x = 0.08 and 0.12) Using a Phenomenological Model
L. T. T. Ngan
N. T. Dang
P. T. Phong
Original Research Article 28 November 2020 Pages: 978 - 986
Effect of Ni Substitution on Optical Transitions and Magnetic Behavior of Mesoporous Ni_xCo_3−xO₄ (0 ≤ x ≤ 1) Thin Films Prepared by Electrophoretic Deposition
Nader Ghobadi
Hamed Bahiraie
Mehdi Kazazzi
Original Research Article 28 November 2020 Pages: 987 - 991
Fabricating Microcracks in SBS-g-MAH/CB Composites to Improve Conductivity and Small Strain-Sensing Sensitivity
Lanlan Wu
Chang Lu
Yan Zhu
Original Research Article 01 January 2021 Pages: 992 - 1001
Nitrogen-Rich Multilayered Porous Carbon for an Efficient and Stable Anode
Guowei Zhao
Wenchao Li
Fanrong Ai
Original Research Article 01 January 2021 Pages: 1002 - 1009
Influence of Ba Doping on the Electrical Behaviour of La_0.9Sr_0.1Al_0.9Mg_0.1O_3−δ System for a Solid Electrolyte
Onkar Nath Verma
Saurabh Singh
Prabhakar Singh
Original Research Article 01 January 2021 Pages: 1010 - 1021
Investigating a Fluorobenzene Based Single Electron Transistor As a Toxic Gas Sensor
Kumar Gaurav
Boddepalli SanthiBhushan
Anurag Srivastava
Original Research Article 01 January 2021 Pages: 1022 - 1031
Effect of La Addition on the Microstructure and Properties of Al-Fe-Mn Alloys for Lithium Battery Current Collectors
Jingkun Zhu
Dongyan Ding
Jinsong Tang
Original Research Article 01 January 2021 Pages: 1032 - 1043
Improved Performance of DSSC Photoanodes After the Modification of TiO₂ with Reduced Graphene Oxide
D. S. U. Peiris
Piyasiri Ekanayake
Mohammad Iskandar Petra
Original Research Article 01 January 2021 Pages: 1044 - 1053
Raman Tensor of Quasi-One-Dimensional ZrTe₅ Thin Flakes
Haiping Chen
Original Research Article 01 January 2021 Pages: 1054 - 1058
Capacity Fading in Li₂FeSiO₄ Cathode Material: Intrinsic or Extrinsic
Prince Babbar
Brajesh Tiwari
Ambesh Dixit
Original Research Article 02 January 2021 Pages: 1059 - 1066
Preparation of g-C₃N₄ with High Specific Surface Area and Photocatalytic Stability
Jing Yang
Xianqian Zhang
Xiande Yang
Original Research Article 02 January 2021 Pages: 1067 - 1074
Tailoring the Size and Magnetization of Titanium-Doped BiFeO₃ Nanorods
P. M. Razad
K. Saravanakumar
K. Mahalakshmi
Original Research Article 02 January 2021 Pages: 1075 - 1082
Effect of Cultivation Conditions on Tin Whisker Growth on Ti₂SnC
Yushuang Liu
Chengjie Lu
ZhengMing Sun
Original Research Article 02 January 2021 Pages: 1083 - 1089
Low Field Magnetic and Electric Transport Properties of LaFeAsO and Oxygen Deficiency of LaFeAsO_x
Yildirhan Oner
Cihat Boyraz
Original Research Article 02 January 2021 Pages: 1090 - 1101
Synthesis, Optical Absorption and Radiation Shielding Performance of Sodium Zinc Borate-Er₂O₃ Glasses
Z. A. Alrowaili
T. A. Taha
K. M. A. Saron
Original Research Article 02 January 2021 Pages: 1102 - 1109
Sub-10-nm Scalability of Emerging Nanowire Junctionless FETs Using a Schottky Metallic Core
Aakash Kumar Jain
Aniket Singha
Original Research Article 02 January 2021 Pages: 1110 - 1118
Magnetization and Magnetic Microscopy Studies in Fe Thin Films
Arout Chelvane Jeyaramane
Ch. D. V. Prasad
Original Research Article 03 January 2021 Pages: 1119 - 1131
Ferroelectric BT–PVDF Composite Thick Films for Electrical Energy Storage
Hicham Ait Laasri
Didier Fasquelle
Mohamed Elaatmani
Original Research Article 03 January 2021 Pages: 1132 - 1139
Surface-Oxidation-Induced Constrained Volume Expansion of Commercial Silicon Flakes as High-Performance Anode Material for Lithium-Ion Batteries
Hao Tang
Xin Jin
Runguang Sun
Original Research Article 03 January 2021 Pages: 1140 - 1145
Effect of Single Crystallization on Thermoelectric Performance Improvement of Ba₈Cu_xSi_46−x Clathrate
Zilong Zhang
Chiho Inoue
Shinji Munetoh
Original Research Article 03 January 2021 Pages: 1146 - 1152
Alternative Method for Production of Pb Halide Perovskite with High Current Response for Photodetection Devices
O. G. Torres
G. Gordillo
J. Roa-Rojas
Original Research Article 03 January 2021 Pages: 1153 - 1161
Gate Capacitance and Off-State Characteristics of E-Mode p-GaN Gate AlGaN/GaN High-Electron-Mobility Transistors After Gate Stress Bias
Yu-Chen Lai
Yi-Nan Zhong
Yue-Ming Hsin
Original Research Article Open access 03 January 2021 Pages: 1162 - 1166
Electrical and Structural Characterization of Poly(3-hexylthiophene)–Polydiphenylamine Blends Synthesized on Various Conductive Substrates
Mayara Masae Kubota
Henrique de Santana
Original Research Article 03 January 2021 Pages: 1167 - 1176
Comparison of I–V Characteristics of the Fabricated SnS/Si and SnS:Ag/Si Heterojunction Solar Cell Under Dark and Illumination
Chandan Rana
Swades Ranjan Bera
Satyajit Saha
Original Research Article 03 January 2021 Pages: 1177 - 1188