Abstract
The microstructure of Sn-Ag-Cu (SAC) solder joints plays an important role in the reliability of electronics, and interlaced twinning has been linked with improved performance. Here, we study the three-dimensional (3-D) shape of interlaced regions in Sn-3.0Ag-0.5Cu (SAC305) solder balls by combining serial sectioning with electron backscatter diffraction. In solder balls without large Ag3Sn plates, we show that the interlaced volume can be reasonably approximated as a hollow double cone with the common 〈100〉 twinning axis as the cone axis, and the 〈110〉 from all three twinned orientations making up the cone sides. This 3-D morphology can explain a range of partially interlaced morphologies in past work on 2-D cross-sections.
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Acknowledgments
The authors gratefully acknowledge financial support from the EPSRC doctoral training partnership grant (EP/N509486/1), and the use of Harvey Flower Microstructural Characterisation at Imperial College London. The authors would also like to express their gratitude to Dr. Sergey Belyakov for making the ingot and Yi Wang for some of the sample preparation.
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Daszki, A.A., Gourlay, C.M. On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls. J. Electron. Mater. 50, 808–817 (2021). https://doi.org/10.1007/s11664-020-08508-w
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DOI: https://doi.org/10.1007/s11664-020-08508-w