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Volume 47, Issue 1

January 2018

Special Section: Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI. Guest Editors:Shih-kang Lin, Chao-hong Wang, and Chih-Ming Chen; and Special Section: Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder. Guest Editors: Fan-Yi Ouyang, Albert Wu, C. Robert Kao, Yan Li, Babak Arfaei, and Kazuhiro Nogita

107 articles in this issue

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