Volume 21, Issue 5

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May 2015

Special issue on WaferBond’13 “International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration”

Issue Editors:

Roy Knechtel,
Frank Niklaus,
Bernd Michel

25 articles in this issue

Special issue WaferBond’13
Roy Knechtel
Frank Niklaus
Bernd Michel
Editorial 27 February 2015 Pages: 951 - 951
Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films
E. Beche
F. Fournel
F. Fillot
Technical Paper 03 February 2015 Pages: 953 - 959
Mechanism involved in direct hydrophobic Si(100)-2×1:H bonding
C. Rauer
H. Moriceau
C. Morales
Technical Paper 10 February 2015 Pages: 961 - 968
Modelling of the direct bonding wave
Damien Radisson
Frank Fournel
Elisabeth Charlaix
Technical Paper 18 February 2015 Pages: 969 - 971
Mechanical understanding of 100 mm InP and GaAs direct bonded heterostructure
B. Imbert
X. Blot
V. Carron
Technical Paper 06 February 2015 Pages: 973 - 977
Conductivity of high-temperature annealed silicon direct wafer bonds
Kari Schjølberg-Henriksen
Lars Geir Whist Tvedt
Dag T. Wang
Technical Paper 31 January 2015 Pages: 979 - 985
Origin of the TTV of thin films obtained by temporary bonding ZoneBond^® technology
P. Montméat
T. Enot
M. Zussy
Technical Paper 06 February 2015 Pages: 987 - 993
Kinetics of low temperature direct copper–copper bonding
P. Gondcharton
B. Imbert
M. Verdier
Technical Paper 01 February 2015 Pages: 995 - 1001
Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation
B. Rebhan
S. Tollabimazraehno
V. Dragoi
Technical Paper 11 February 2015 Pages: 1003 - 1013
UV/O₃ assisted InP/Al₂O₃–Al₂O₃/Si low temperature die to wafer bonding
P. Anantha
C. S. Tan
Technical Paper 03 February 2015 Pages: 1015 - 1020
Wafer level vacuum packaging of micro-mirrors with buried signal lines
S. Langa
C. Drabe
C. Kaden
Technical Paper 01 February 2015 Pages: 1021 - 1028
Silicon–ceramic–silicon-wafercompound fabricated by using nanostructured silicon surfaces and a ceramic with adapted thermal expansion coefficient
S. Günschmann
M. Fischer
J. Müller
Technical Paper 07 February 2015 Pages: 1029 - 1034
Laser welding of sapphire wafers using a thin-film fresnoite glass solder
Araceli de Pablos-Martín
M. Ebert
Th. Höche
Technical Paper 20 December 2014 Pages: 1035 - 1045
Design of compact and wide bandwidth SPDT with anti-stiction torsional RF MEMS series capacitive switch
Deepak Bansal
Amit Kumar
K. J. Rangra
Technical Paper 20 June 2014 Pages: 1047 - 1052
Fabrication and characterization of MEMS piezoelectric synthetic jet actuators with bulk-micromachined PZT thick film
Shushan Wang
Binghe Ma
Jian Luo
Technical Paper 29 July 2014 Pages: 1053 - 1059
The on-chip temperature compensation and temperature control research for the silicon micro-gyroscope
Bo Yang
Bo Dai
Xingjun Wang
Technical Paper 25 July 2014 Pages: 1061 - 1072
A complete analytical model for circular diaphragm pressure sensor with freely supported edge
Sumit Kumar Jindal
Sanjeev Kumar Raghuwanshi
Technical Paper 10 April 2014 Pages: 1073 - 1079
Small modified printed planar ultrawide band disc antennas with etched ground plane
G. Sasibhushana Rao
S. Srinivasa Kumar
Ramu Pillalamarri
Technical Paper 17 May 2014 Pages: 1081 - 1086
Wide-band millimetre-wave antenna based on Si and suspended BCB membrane
Seonho Seok
Janggil Kim
Nathalie Rolland
Technical Paper 23 April 2014 Pages: 1087 - 1092
Fabrication and characterization of a dry electrode integrated Gecko-inspired dry adhesive medical patch for long-term ECG measurement
Long-Fei Wang
Jing-Quan Liu
Chun-Sheng Yang
Technical Paper 19 August 2014 Pages: 1093 - 1100
Local thermal-assisted ultrasonic embossing for the fabrication of polymer microstructures
Na Qi
Yi Luo
Zong-bo Zhang
Technical Paper 23 August 2014 Pages: 1101 - 1110
The plastic and creep characteristics of silicon microstructure at elevated temperature
Shaokang Yao
Dehui Xu
Yuelin Wang
Technical Paper 05 May 2014 Pages: 1111 - 1119
Development of a novel microviscosity model based on molecular chain length
Yan Lou
Jiulong Pei
Xiaoyu Wu
Technical Paper 13 June 2014 Pages: 1121 - 1130
Fabrication of miniature parts using nano-sized powders and an environmentally friendly binder through micro powder injection molding
Javad Rajabi
Hafizawati Zakaria
Abdolali Fayyaz
Technical Paper 26 July 2014 Pages: 1131 - 1136
Governance, policy, and legislation of nanotechnology: a perspective
Bharat Bhushan
Technical Paper 04 April 2015 Pages: 1137 - 1155

Volume 21, Issue 5

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