Abstract
Direct bonding at room temperature and ambient pressure is well established for planar surfaces (Tong and Gösele 1999) but numerous device elaborations require direct bonding of structured surfaces as for example for some MEMS or bio chips. Based on the one dimensional (1D) bonding wave model of Rieutord et al. (2005), a two dimensional (2D) simulation based on wafer mechanical deformation and trapped air flow will be presented. Our model takes into account possible lateral air flow, and is thus well suited to simulate, for example, the bonding of structured wafer with rectangular cavities whose length are parallel or perpendicular to the bonding wave direction. Experiments showed that rectangular cavities parallel to the direction of the bonding front propagation improve the bonding front velocity. A law of the evolution of the bonding wave speed depending on the width between the cavities has been obtained by studying the bonding of beams of varying width.
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00542-015-2445-3/MediaObjects/542_2015_2445_Fig1_HTML.jpg)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00542-015-2445-3/MediaObjects/542_2015_2445_Fig2_HTML.jpg)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00542-015-2445-3/MediaObjects/542_2015_2445_Fig3_HTML.gif)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00542-015-2445-3/MediaObjects/542_2015_2445_Fig4_HTML.gif)
Similar content being viewed by others
References
Grierson D, Turner KT (2010) Characterization of hysteresis of surface energy in room-temperature direct bonding processes. ECS Trans 33(4):573–580
Landau LD, Lifshitz EM (1986) Theory of Elasticity, 3rd ed. Pergamon Press, Oxford
Navarro E, Bréchet Y, Moreau R, Pardoen T, Raskin J-P, Barthelemy A, Radu I (2013) Direct silicon bonding dynamics: a coupled fluid/structure analysis. Appl Phys Lett 103:034104
Radisson D (2014) Direct bonding of patterned surfaces. Dissertation, université de Grenoble
Rieutord F, Bataillou B, Moriceau H (2005) Dynamics of a bonding front. Phys Rev Lett 94:236101
Tong Q-Y, Gösele U (1999) Semiconductor wafer bonding: science and technology. Wiley, New York
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Radisson, D., Fournel, F. & Charlaix, E. Modelling of the direct bonding wave. Microsyst Technol 21, 969–971 (2015). https://doi.org/10.1007/s00542-015-2445-3
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00542-015-2445-3