Abstract
In this paper, we have developed a fabrication process for micro synthetic jet actuators (SJA) by bonding a high-quality Pb (Zr,Ti) O3 (PZT) ceramic wafer to a silicon wafer using epoxy resin at low temperature (<150 °C). The bulk-PZT was lapped and polished to be PZT thick film by chemical mechanical polishing (CMP) method, and patterned by wet-etching method. The cavity and orifice of SJA were formed by inductive coupled plasma etching (ICP) method. A MEMS piezoelectric SJA was then completed and characterized, including the performance of the PZT thick film. While the dimension of bonded PZT thick film is about 6,000 × 6,000 × 100 μm, and the dimension of Si membrane is about 1,000 × 1,000 × 20 μm. The experimental results show that the maximum center amplitude of PZT-Si diaphragm is 15.05 μm at Vp-p of 90 V and the resonant frequency of 5 kHz, and the maximum jet velocity is higher than 11 m/s. This novel process has great potential to fabricate MEMS piezoelectric synthetic jet actuators.
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This work is supported by the Natural Science Foundation of China (no 51105317).
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Wang, S., Ma, B., Deng, J. et al. Fabrication and characterization of MEMS piezoelectric synthetic jet actuators with bulk-micromachined PZT thick film. Microsyst Technol 21, 1053–1059 (2015). https://doi.org/10.1007/s00542-014-2278-5
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DOI: https://doi.org/10.1007/s00542-014-2278-5