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Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application Jianfeng YanGuisheng ZouY. Norman Zhou OriginalPaper 09 March 2012 Pages: 1886 - 1892
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Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders Omid MokhtariAli RoshanghiasSamjid H. Mannan OriginalPaper Open access 07 March 2012 Pages: 1907 - 1914
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New Method for Evaluating the Peltier Coefficient Based on Temperature Measurements in a Thermoelectric Module J. GarridoA. Casanovas OriginalPaper 25 February 2012 Pages: 1990 - 1995
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Mechanical Properties of Anisotropic Conductive Adhesive Film Under Hygrothermal Aging and Thermal Cycling Li-Lan GaoXu ChenHong Gao OriginalPaper 16 March 2012 Pages: 2001 - 2009
Long-Term Stability of Mold Compounds and the Influence on Semiconductor Device Reliability Joachim MahlerManfred Mengel OriginalPaper 21 March 2012 Pages: 2010 - 2017
Shear Strength and Failure Modes of As-Bonded Gold and Copper Ball Bonds on Aluminum Metallization C.D. BreachT.K. Lee OriginalPaper 24 February 2012 Pages: 2018 - 2028
