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Influence of 0.03 wt.% Carbon Black Addition on the Performance of Sn-3.5Ag Lead-Free Solder

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Abstract

In an effort to improve the performance of lead-free solder, Sn-3.5 wt.%Ag (Sn-3.5Ag) solder alloy with 0.03 wt.% carbon black was prepared under high pressure (5.5 GPa) and high temperature (1200°C). We have investigated the microstructure, melting behavior, and mechanical properties of the alloy using x-ray diffraction, differential scanning calorimetry (DSC), Vickers hardness testing, tensile testing, and scanning electron microscopy (SEM). The melting point was found to be unchanged, while the hardness and the tensile strength increased with the addition of carbon black. SEM images showed that the average thickness of the intermetallic compound (IMC) layer decreased with the addition of carbon black, indicating improvement in solder joint reliability.

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Author notes

  1. Phung Van Son

    Present address: Department of Physics, Danang University of Education, 459 Ton Duc Thang, Danang, Vietnam

Authors and Affiliations

  1. Institute of Materials Science, University of Tsukuba, Tsukuba, 305-8573, Japan

    Phung Van Son, Akira Fujitsuka & Ken-Ichi Ohshima

Authors
  1. Phung Van Son
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  2. Akira Fujitsuka
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  3. Ken-Ichi Ohshima
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Correspondence to Ken-Ichi Ohshima.

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Van Son, P., Fujitsuka, A. & Ohshima, KI. Influence of 0.03 wt.% Carbon Black Addition on the Performance of Sn-3.5Ag Lead-Free Solder. J. Electron. Mater. 41, 1893–1897 (2012). https://doi.org/10.1007/s11664-012-2023-8

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  • DOI: https://doi.org/10.1007/s11664-012-2023-8

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