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Three Dimensional Integrated Circuit Design

EDA, Design and Microarchitectures

  • Yuan Xie
  • Jason Cong
  • Sachin Sapatnekar

Part of the Integrated Circuits and Systems book series (ICIR)

Table of contents

  1. Front Matter
    Pages i-xii
  2. Kerry Bernstein
    Pages 1-13
  3. Albert M. Young, Steven J. Koester
    Pages 15-32
  4. Pulkit Jain, Pingqiang Zhou, Chris H. Kim, Sachin S. Sapatnekar
    Pages 33-61
  5. Jason Cong, Yuchun Ma
    Pages 63-102
  6. Jason Cong, Guojie Luo
    Pages 103-144
  7. Gabriel H. Loh
    Pages 161-188
  8. Yuan Xie, Narayanan Vijaykrishnan, Chita Das
    Pages 189-217
  9. Taeho Kgil, David Roberts, Trevor Mudge
    Pages 219-260
  10. Xiangyu Dong, Yuan Xie
    Pages 261-280
  11. Back Matter
    Pages 281-284

About this book

Introduction

This book presents an overview of the field of 3D IC design, with an

emphasis on electronic design automation (EDA) tools and algorithms

that can enable the adoption of 3D ICs, and the architectural

implementation and potential for future 3D system design. The aim of

this book is to provide the reader with a complete understanding of:

  • the promise of 3D ICs in building novel systems that enable the chip

industry to continue along the path of performance scaling,

  • the state of the art in fabrication technologies for 3D integration,

  • the most prominent 3D-specific EDA challenges, along with solutions

and best practices,

  • the architectural benefits of using 3D technology,

  • architectural-and system-level design issues, and

  • the cost implications of 3D IC design.

Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design.

Keywords

FPGA automation circuit design design integrated circuit microprocessor network technology

Editors and affiliations

  • Yuan Xie
    • 1
  • Jason Cong
    • 2
  • Sachin Sapatnekar
    • 3
  1. 1.Dept. Computer Science & EngineeringPennsylvania State UniversityUniversity ParkU.S.A.
  2. 2.Dept. Computer ScienceUniversity of California, Los AngelesLos AngelesU.S.A.
  3. 3.Institute of TechnologyUniversity of MinnesotaMinneapolisU.S.A.

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-0784-4
  • Copyright Information Springer-Verlag US 2010
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-0783-7
  • Online ISBN 978-1-4419-0784-4
  • Series Print ISSN 1558-9412
  • Buy this book on publisher's site