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Structure and properties of low-Ag SAC solders for electronic packaging

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Abstract

Since the high cost of Ag, current research on traditional high-Ag solders has gradually shifted to low-Ag solders. However, the microstructure tends to be coarser, and the all-around performance declines as the Ag content decreases. Fortunately, doping alloying elements or nanoparticles has proven efficient in enhancing low-Ag solders' properties. Furthermore, choosing a suitable surface treatment technique or employing magnet stirring for the molten solders also makes a significant difference. To further promote research regarding low-Ag solders, this paper mainly reviews the effects of alloying and particle reinforcement on melting characteristics, wettability, microstructure, interfacial reaction, mechanical properties, creep resistance, reliability and corrosion resistance, and the progress of modified low-Ag solders have also been systematically summarized and analyzed. Finally, the challenges and research gaps for low-Ag solders have been provided.

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Acknowledgements

The present work was under the support of Natural Science Foundation of Jiangsu Province (BK20211351).

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  1. School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Xiao Lu, Liang Zhang, Wang Xi & Mu-lan Li

  2. School of Materials Science and Engineering, Xiamen University of Technology, Xiamen, 361000, China

    Liang Zhang

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XL: Data curation, Writing—original draft preparation, LZ: Writing—reviewing and editing, ML, XW: Writing—reviewing and editing.

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Lu, X., Zhang, L., Xi, W. et al. Structure and properties of low-Ag SAC solders for electronic packaging. J Mater Sci: Mater Electron 33, 22668–22705 (2022). https://doi.org/10.1007/s10854-022-09091-y

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