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Corrosion and Electrochemical Behavior of Sn-2Ag-0.5Cu Lead-Free Solders Solidified with Magnet Stirring

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Abstract

In this study, permanent magnet stirring (PMS) was applied to modify the crystallographic texture and corrosion resistance of Sn-2Ag-0.5Cu (SAC205) solders. The results indicate that PMS transforms the lamellar structure into equiaxed grains. Following the initiation corrosion process, the crystallographic texture shows a new class of grains that consists of single-crystal morphology with {111}Sn facets before applying PMS. This could result in severe corrosion of β-Sn crystals with non-uniform corrosion rate caused by the orientation effect of (111). The corrosion rate for SAC205 solder, measured by immersion tests in 3.5% NaCl solution at 25 °C, was significantly decreased from 31 to 8 mpy after applying PMS. This change in corrosion resistance of SAC205 solder can be attributed to the improved anodic and cathodic reaction activities caused by the modification of microstructure and crystallographic texture. The mechanism of pitting and sequential corrosion events is fully explained and discussed.

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Authors and Affiliations

  1. Physics Department, Faculty of Science, Zagazig University, Zagazig, Egypt

    A. A. El-Daly

  2. Higher Technological Institute, 10th of Ramadan City, Egypt

    K. M. Zohdy & M. Ragab

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  1. A. A. El-Daly
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El-Daly, A.A., Zohdy, K.M. & Ragab, M. Corrosion and Electrochemical Behavior of Sn-2Ag-0.5Cu Lead-Free Solders Solidified with Magnet Stirring. J. of Materi Eng and Perform 28, 4680–4692 (2019). https://doi.org/10.1007/s11665-019-04227-4

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  • DOI: https://doi.org/10.1007/s11665-019-04227-4

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