Review of Capabilities of the ENEPIG Surface Finish Menahem RatzkerAdam PearlGeorge Milad ReviewPaper 07 August 2014 Pages: 3885 - 3897
Fabrication of Relaxer-Based Piezoelectric Energy Harvesters Using a Sacrificial Poly-Si Seeding Layer E. M. A. Fuentes-FernandezA. M. Salomon-PreciadoH. N. Alshareef OriginalPaper 07 August 2014 Pages: 3898 - 3904
Achieving Both High d 33 and High Q m for the Pb(Zr0.26Sn0.26Ti0.48)1−x Fe x O3−x/2 Ternary System for Use in High-Power Ultrasonic Transducers Zhuo XingLi JinXiaoyong Wei OriginalPaper 29 July 2014 Pages: 3905 - 3911
A Branched Beam-Based Vibration Energy Harvester Guangcheng ZhangJunhui Hu OriginalPaper 16 September 2014 Pages: 3912 - 3921
Sensor Performance of Nanostructured TiO2–Cr2O3 Thin Films Derived by a Particulate Sol–Gel Route with Various Cr:Ti Molar Ratios M.R. MohammadiD.J. Fray OriginalPaper 22 July 2014 Pages: 3922 - 3932
Study of Shallow Backside Junctions for Backside Illumination of CMOS Image Sensors Chung Seok ChoiSang Chul YeoHyuck Mo Lee OriginalPaper 14 August 2014 Pages: 3933 - 3941
Preparation, Infrared Emissivity, and Dielectric and Microwave Absorption Properties of Fe-Doped ZnO Powder Xiaolei SuYan JiaSongtao Liu OriginalPaper 19 July 2014 Pages: 3942 - 3948
Design of Polarization- and Incident Angle-Independent Perfect Metamaterial Absorber with Interference Theory Furkan DincerMuharrem KaraaslanCumali Sabah OriginalPaper 14 August 2014 Pages: 3949 - 3953
Effect of Excess Li Content on the Microwave Dielectric Properties of the M-Phase of Li2O-Nb2O5-TiO2 Ceramics Enzhu LiMengying ZouXiaohua Zhou OriginalPaper 29 July 2014 Pages: 3954 - 3958
Effects of Ta2O5/Y2O3 Codoping on the Microstructure and Microwave Dielectric Properties of Ba(Co0.56Zn0.40)1/3Nb2/3O3 Ceramics Tang BinSi FengZhang Shu-ren OriginalPaper 14 August 2014 Pages: 3959 - 3964
Nanoscale Investigation of Grain Growth in RF-Sputtered Indium Tin Oxide Thin Films by Scanning Probe Microscopy B. S. LamsalM. DubeyQ. H. Fan OriginalPaper 18 July 2014 Pages: 3965 - 3972
Effects of Rapid Thermal Annealing on Electrical Transport in Heavily Doped ZnO Thin Films Deposited at Different Substrate Temperatures Ke ZhuYe YangWeijie Song OriginalPaper 22 July 2014 Pages: 3973 - 3978
Characterization of CdS Nanowires Self-Assembled in a Nanoporous Alumina Template Shripriya PoduriMitra DuttaMichael Stroscio OriginalPaper 29 July 2014 Pages: 3979 - 3983
Photoassisted Chemically Deposited Tin Sulfide Thin Films Based on Two Different Chemical Formulations T. L. RemadeviA. C. DhanyaK. Deepa OriginalPaper 14 August 2014 Pages: 3984 - 3992
Impact of Tellurium Precipitates in CdZnTe Substrates on MBE HgCdTe Deposition J. D. BensonL. O. BubulacS. Couture OriginalPaper 14 August 2014 Pages: 3993 - 3998
Hall Effect Studies of AlGaAs Grown by Liquid-Phase Epitaxy for Tandem Solar Cell Applications Xin ZhaoKyle H. MontgomeryJerry M. Woodall OriginalPaper 14 August 2014 Pages: 3999 - 4002
Development of Polyaniline Using Electrochemical Technique for Plugging Pinholes in Cadmium Sulfide/Cadmium Telluride Solar Cells N. A. Abdul-ManafO. K. EchenduI. M. Dharmadasa OriginalPaper 05 September 2014 Pages: 4003 - 4010
Effects of Substrate Temperature on the Microstructure and Morphology of CdZnTe Thin Films Hasan MalkasSenol KayaErcan Yilmaz OriginalPaper 16 September 2014 Pages: 4011 - 4017
Synthesis and Characterization of the 25Ga2S3-(75 − x) GeS2-xCsCl System for Engineering a Chemically Stable, Mid-IR Transparent Glass Inseok Seo OriginalPaper 14 August 2014 Pages: 4018 - 4022
Density, Electrical and Optical Properties of Yttrium-Containing Tellurium Bismuth Borate Glasses M. H. ShaabanA. A. Ali OriginalPaper 07 August 2014 Pages: 4023 - 4032
Effect of Sprayed Solution Flow Rate on the Physical Properties of Anatase TiO2 Thin Films Wafa NaffoutiTarek Ben NasrNajoua Kamoun-Turki OriginalPaper 14 August 2014 Pages: 4033 - 4040
Electron Paramagnetic Resonance and Photoluminescence Studies of LaMgAl11O19:Mn2+ Green Phosphors Vijay SinghR. P. S. ChakradharS. H. Kim OriginalPaper 05 September 2014 Pages: 4041 - 4047
Synthesis and Thermoelectric Properties of Yb-doped Ca0.9−x Yb x La0.1MnO3 Ceramics Bo ZhangAimin ChangYiquan Wu OriginalPaper 19 August 2014 Pages: 4048 - 4055
Properties of p- and n-Type PbTe Microwires for Thermoelectric Devices Rudra P. BhattaMark HendersonBiprodas Dutta OriginalPaper 29 July 2014 Pages: 4056 - 4063
Interfacial Reaction Between Nb Foil and n-Type PbTe Thermoelectric Materials During Thermoelectric Contact Fabrication Haiyang XiaCheng-Lung ChenG. Jeffrey Snyder OriginalPaper 19 August 2014 Pages: 4064 - 4069
Design, Modeling, Fabrication, and Evaluation of Thermoelectric Generators with Hot-Wire Chemical Vapor Deposited Polysilicon as Thermoelement Material Maria Theresa de LeonAntulio TarazonaMichael Kraft OriginalPaper 19 August 2014 Pages: 4070 - 4081
Thermodynamic Re-modeling of the Sb-Te System Using Associate and Ionic Models Cuiping GuoChangrong LiZhenmin Du OriginalPaper 22 July 2014 Pages: 4082 - 4089
The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading Toni T. MattilaJussi HokkaMervi Paulasto-Kröckel OriginalPaper 22 July 2014 Pages: 4090 - 4102
Interface Reaction Between Electroless Ni–Sn–P Metallization and Lead-Free Sn–3.5Ag Solder with Suppressed Ni3P Formation Ying YangJ. N. BalarajuZhong Chen OriginalPaper 19 August 2014 Pages: 4103 - 4110
Phase Equilibria of the Sn-Ni-V System at 800°C Changjun WuXuping SuYifan Zhang OriginalPaper 29 July 2014 Pages: 4111 - 4118
IMC Growth at the Interface of Sn–2.0Ag–2.5Zn Solder Joints with Cu, Ni, and Ni–W Substrates Jiaxing LiangHaozhe WangMing Li OriginalPaper 25 July 2014 Pages: 4119 - 4125
Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn–Ag–Cu and Sn–Ag Solder Interconnects With and Without Board-Side Ni Surface Finish Tae-Kyu LeeJeng-Gong Duh OriginalPaper 30 July 2014 Pages: 4126 - 4133
Investigation of the Growth of Intermetallic Compounds Between Cu Pillars and Solder Caps Jui-Ching LinYi QinJulia Woertink OriginalPaper 07 August 2014 Pages: 4134 - 4145
Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni A.E. HammadA.M. El-Taher OriginalPaper 26 July 2014 Pages: 4146 - 4157
Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint Omid MokhtariHiroshi Nishikawa OriginalPaper 05 September 2014 Pages: 4158 - 4170
Mechanical Properties of Lead-Free Solder Joints Under High-Speed Shear Impact Loading Van Luong NguyenHo-Kyung Kim OriginalPaper 09 September 2014 Pages: 4171 - 4178
Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders Xu ZhaoMasumi SakaHiroaki Hokazono OriginalPaper 13 September 2014 Pages: 4179 - 4185
Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry Ting JiangHong Lei OriginalPaper 22 July 2014 Pages: 4186 - 4192
Impact of Ni Concentration on the Performance of Ni Silicide/HfO2/TiN Resistive RAM (RRAM) Cells Z.X. ChenZ. FangY.H. Wu OriginalPaper 29 July 2014 Pages: 4193 - 4198
Elemental Compositions of Over 80 Cell Phones Beverley ChristianAlexandre RomanovLaura J. Turbini OriginalPaper 14 August 2014 Pages: 4199 - 4213
Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films Yongwon ChoiJiwon ShinKyung-Wook Paik OriginalPaper 08 August 2014 Pages: 4214 - 4223
Carbon-Incorporated Amorphous Indium Zinc Oxide Thin-Film Transistors S. ParthibanK. ParkJ.-Y. Kwon OriginalPaper 22 August 2014 Pages: 4224 - 4228
An RDL UBM Structural Design for Solving Ultralow-K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging K. M. ChenC. Y. WuN. C. Huang OriginalPaper 20 August 2014 Pages: 4229 - 4240
Zinc Oxide Thin-Film Transistors Fabricated at Low Temperature by Chemical Spray Pyrolysis Yesul JeongChristopher PearsonMichael C. Petty BriefCommunication 14 August 2014 Pages: 4241 - 4245
Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process Seung-Woo LeeTae-Hyung LeeJae-Hak Lee OriginalPaper 27 August 2014 Pages: 4246 - 4254
Electromigration Induced Break-up Phenomena in Liquid Metal Printed Thin Films Rongchao MaCangran GuoJing Liu OriginalPaper 26 August 2014 Pages: 4255 - 4261
Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits W. L. ShihT. L. YangC. R. Kao OriginalPaper 05 September 2014 Pages: 4262 - 4265
Statistical Parameters Effects on Photocatalytic Degradation of Rhodamine 6G Dye with Hexagonal Zinc Oxide Nanorods Synthesized via Solution Process Rizwan WahabFarheen Khan OriginalPaper 13 September 2014 Pages: 4266 - 4274
Formation of a Metastable Phase at the Interface Between Sn and Ag–Pd Substrates During Liquid-State Reaction Hsin-fu LinChih-chi Chen OriginalPaper 06 September 2014 Pages: 4275 - 4281
Investigating the Exchange-Coupling Interaction in Nanostructure Composite Particles of SrFe12O19 and ZnFe2O4 M. MehdipourH. ShokrollahiA. Bahadoran OriginalPaper Open access 05 September 2014 Pages: 4282 - 4288