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Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits

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Abstract

Soldering reactions in very confined spaces are becoming an increasingly important issue owing to their applications for micro-joints in three-dimensional integrated circuits. Gold embrittlement is becoming relevant again as soldering joints become smaller. In this study, the maximum allowable Au content in micro-joints is investigated, and it was determined to be 1.3 wt.%. Direct Cu doping in solder can prevent the formation of AuSn4. Nevertheless, direct Cu doping may not be effective if the Au concentration is too high. It is demonstrated that using Cu under bump metallization can completely inhibit the formation of AuSn4 and eliminate the risk of gold embrittlement.

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Authors and Affiliations

  1. Department of Materials Science & Engineering, National Taiwan University, Taipei, Taiwan

    W. L. Shih, T. L. Yang, H. Y. Chuang, M. S. Kuo & C. R. Kao

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  1. W. L. Shih
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  2. T. L. Yang
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  3. H. Y. Chuang
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  4. M. S. Kuo
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  5. C. R. Kao
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Correspondence to C. R. Kao.

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Shih, W.L., Yang, T.L., Chuang, H.Y. et al. Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits. J. Electron. Mater. 43, 4262–4265 (2014). https://doi.org/10.1007/s11664-014-3360-6

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  • DOI: https://doi.org/10.1007/s11664-014-3360-6

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