1. Foreword

   • Mike Capano
   • Huili (Grace) Xing

   EditorialNotes 10 April 2009 Pages: 717 - 717

2. Temperature Dependence of Epitaxial Graphene Formation on SiC(0001)

   • Luxmi
   • Shu Nie
   • Yugang Sun

   OriginalPaper Open access 21 October 2008 Pages: 718 - 724

3. Thickness Estimation of Epitaxial Graphene on SiC Using Attenuation of Substrate Raman Intensity

   • Shriram Shivaraman
   • M. V. S. Chandrashekhar
   • Michael G. Spencer

   OriginalPaper 21 April 2009 Pages: 725 - 730

4. Growth of Graphene-Like Structures on an Oxidized SiC Surface

   • Weijie Lu
   • W.C. Mitchel
   • L.C. Feldman

   OriginalPaper 28 February 2009 Pages: 731 - 736

5. Growth and Characterization of Carbon Nanopearls on a Si Substrate by CVD Process

   • S. Houston
   • G. J. Brown
   • A. Smetana

   OriginalPaper 21 February 2009 Pages: 737 - 741

6. A Study of Deterministic Positioning of Carbon Nanotubes by Dielectrophoresis

   • A. Arun
   • P. Salet
   • A. M. Ionescu

   OriginalPaper 14 April 2009 Pages: 742 - 749

7. Field Emission and Electric Discharge of Nanocrystalline Diamond Films

   • Bohr-Ran Huang
   • Shyankay Jou
   • Meng-Chang wu

   OriginalPaper 18 February 2009 Pages: 750 - 755

8. Geometrical Characteristics and Surface Polarity of Inclined Crystallographic Planes of the Wurtzite and Zincblende Structures

   • Hisashi Masui
   • Samantha C. Cruz
   • Steven P. DenBaars

   OriginalPaper Open access 10 April 2009 Pages: 756 - 760

9. Phosphor-Concentration-Dependent Characteristics of White LEDs in Different Current Regulation Modes

   • Jiun Pyng You
   • Nguyen T. Tran
   • Frank G. Shi

   OriginalPaper Open access 03 April 2009 Pages: 761 - 766

10. Improved Gettering Efficiency of Ni from Nickel-Mediated Crystallization Silicon Using Phosphorus-Doped Amorphous Silicon

    • Bau-Ming Wang
    • Yewchung Sermon Wu

    OriginalPaper 28 March 2009 Pages: 767 - 771

11. Improved Ni Schottky Contacts on n-Type 4H-SiC Using Thermal Processing

    • T. N. Oder
    • T. L. Sung
    • T. Isaacs-Smith

    OriginalPaper 12 March 2009 Pages: 772 - 777

12. Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization

    • Venmathy Rajarathinam
    • C. Hunter Lightsey
    • Paul A. Kohl

    OriginalPaper 19 March 2009 Pages: 778 - 786

13. Growth and Characterization of Zn-Incorporated Copper Oxide Films

    • M. Engin
    • F. Atay
    • I. Akyuz

    OriginalPaper 05 March 2009 Pages: 787 - 796

14. Impact of Ti Sputter Target Denitridation on the Crystallographic Orientation of Single Ti Layers and Ti/TiN/AlCu Layer Stacks on Different Oxides

    • D. Wolansky
    • P. Zaumseil

    OriginalPaper 21 April 2009 Pages: 797 - 801

15. Microstructure Evolution and the Constitutive Relations of High-Temperature Solders

    • Harry Schoeller
    • Shubhra Bansal
    • Junghyun Cho

    OriginalPaper 31 March 2009 Pages: 802 - 809

16. Nanotribological Characteristics of Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄ Intermetallic Compounds

    • Ping-Feng Yang
    • Sheng-Rui Jian
    • Rong-Sheng Chen

    OriginalPaper 31 March 2009 Pages: 810 - 814

17. An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

    • Weiqiang Wang
    • Anupam Choubey
    • Michael Pecht

    OriginalPaper 14 April 2009 Pages: 815 - 827

18. Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders

    • N. Zhao
    • X.M. Pan
    • L. Wang

    OriginalPaper 14 April 2009 Pages: 828 - 833

19. Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability

    • Wan Ho Song
    • Chunjin Hang
    • John Persic

    OriginalPaper 03 April 2009 Pages: 834 - 842

20. Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

    • Olli Nousiainen
    • Tero Kangasvieri
    • Jouko Vähäkangas

    OriginalPaper 14 April 2009 Pages: 843 - 851

21. Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints

    • Q. K. Zhang
    • H. F. Zou
    • Z. F. Zhang

    OriginalPaper 10 April 2009 Pages: 852 - 859

22. Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint

    • Fengshun Wu
    • Bo Wang
    • Yiping Wu

    OriginalPaper 05 March 2009 Pages: 860 - 865

23. Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg_3.0Cu_0.5/Cu Joints: Experimental and First-Principles Study

    • Wei Zhou
    • Lijuan Liu
    • Ping Wu

    OriginalPaper 03 April 2009 Pages: 866 - 872

24. Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates

    • Seongjun Kim
    • Keun-Soo Kim
    • Goro Izuta

    OriginalPaper 10 April 2009 Pages: 873 - 883

25. High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

    • E.H. Wong
    • S.K.W. Seah
    • C.-L. Yeh

    OriginalPaper 09 April 2009 Pages: 884 - 895

26. Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment

    • Sun Sik Kim
    • Keun Soo Kim
    • Katsuaki Suganuma

    OriginalPaper 19 March 2009 Pages: 896 - 901

27. Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes

    • Bo-In Noh
    • Jeong-Won Yoon
    • Seung-Boo Jung

    OriginalPaper 10 March 2009 Pages: 902 - 907

28. Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board

    • Chi-pu Lin
    • Chih-ming Chen

    OriginalPaper 21 April 2009 Pages: 908 - 914