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Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment

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Abstract

In the present study, the degradation of the Ag-epoxy conductive adhesive/Sn interface at 85°C and 85% relative humidity was investigated through a variety of microstructural analyses. After the humidity test, the interfacial electrical resistance increased, and the interface was easily separated by external stress. Transmission electron microscopic (TEM) analyses indicated that two different Sn oxides, namely SnO and SnO2, were formed inhomogeneously at the interface in the humidity test. In addition, many voids were formed at the interface between Sn oxides and Sn plating. These Sn oxides and voids were the cause of the interfacial degradation.

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Authors and Affiliations

  1. The Institute of Scientific and Industrial Research, Osaka University, Ibaraki, Osaka, 567-0047, Japan

    Sun Sik Kim, Keun Soo Kim & Katsuaki Suganuma

  2. Department of Adaptive Machine Systems, Osaka University, Suita, Osaka, 567-0871, Japan

    Seong Jun Kim

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  1. Sun Sik Kim
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  2. Keun Soo Kim
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  3. Seong Jun Kim
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  4. Katsuaki Suganuma
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Correspondence to Sun Sik Kim.

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Kim, S.S., Kim, K.S., Kim, S.J. et al. Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment. J. Electron. Mater. 38, 896–901 (2009). https://doi.org/10.1007/s11664-009-0738-y

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  • DOI: https://doi.org/10.1007/s11664-009-0738-y

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