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An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

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The worldwide transition to lead-free electronics has increased the usage of several lead-free pad finishes for electronic assembly manufacturers, including immersion silver, immersion tin, electroless nickel-immersion gold, and organic solderability preservatives. This study assesses and compares immersion silver as a circuit board finish in terms of its ease of use, wettability, solderability, shelf life, appearance, solder joint strength, intermetallic and void formation, reliability, and costs.

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Authors and Affiliations

  1. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD, 20742, USA

    Weiqiang Wang, Anupam Choubey, Michael H. Azarian & Michael Pecht

  2. City University of Hong Kong, Kowloon, Hong Kong SAR

    Michael Pecht

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  1. Weiqiang Wang
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  2. Anupam Choubey
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  3. Michael H. Azarian
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  4. Michael Pecht
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Correspondence to Michael Pecht.

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Wang, W., Choubey, A., Azarian, M.H. et al. An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics. J. Electron. Mater. 38, 815–827 (2009). https://doi.org/10.1007/s11664-009-0761-z

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  • DOI: https://doi.org/10.1007/s11664-009-0761-z

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