1. Foreword

   • Sung K. Kang
   • Iver Anderson
   • Kejun Zeng

   EditorialNotes 28 August 2009 Pages: 2427 - 2428

2. Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy

   • Jicheng Gong
   • Paul P. Conway
   • Vadim V. Silberschmidt

   OriginalPaper 30 June 2009 Pages: 2429 - 2435

3. Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate

   • Jagjiwan Mittal
   • Shih-Ming Kuo
   • Kwang-Lung Lin

   OriginalPaper 12 September 2009 Pages: 2436 - 2442

4. Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints

   • S. W. Liang
   • Hsiang-Yao Hsiao
   • Yi-Shao Lai

   OriginalPaper 13 August 2009 Pages: 2443 - 2448

5. Effect of Wet Pretreatment on Interfacial Adhesion Energy of Cu-Cu Thermocompression Bond for 3D IC Packages

   • Eun-Jung Jang
   • Seungmin Hyun
   • Young-Bae Park

   OriginalPaper 10 September 2009 Pages: 2449 - 2454

6. Interfacial Adhesion Characteristics Between Electroless-Plated Ni and Polyimide Films Modified by Alkali Surface Pretreatment

   • Kyoung-Jin Min
   • Sung-Cheol Park
   • Young-Bae Park

   OriginalPaper 12 September 2009 Pages: 2455 - 2460

7. The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

   • Sun-Kyoung Seo
   • Sung K. Kang
   • Hyuck Mo Lee

   OriginalPaper 07 August 2009 Pages: 2461 - 2469

8. Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces

   • H.Y. Guo
   • J.D. Guo
   • J.K. Shang

   OriginalPaper 25 June 2009 Pages: 2470 - 2478

9. Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates

   • M. E. Alam
   • S. M. L. Nai
   • M. Gupta

   OriginalPaper 26 August 2009 Pages: 2479 - 2488

10. Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test

    • Sang-Su Ha
    • Jin-Kyu Jang
    • Seung-Boo Jung

    OriginalPaper 18 August 2009 Pages: 2489 - 2495

11. Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength Through Modeling and Testing

    • Chia-Yen Tan
    • Jenq-Gong Duh

    OriginalPaper 11 September 2009 Pages: 2496 - 2505

12. Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings

    • John P. Daghfal
    • P. J. Shang
    • J. K. Shang

    OriginalPaper 31 July 2009 Pages: 2506 - 2515

13. Mitigation of Sn Whisker Growth by Composite Ni/Sn Plating

    • Aleksandra Dimitrovska
    • Radovan Kovacevic

    OriginalPaper 28 August 2009 Pages: 2516 - 2524

14. Multiphase Field Simulations of Intermetallic Compound Growth During Lead-Free Soldering

    • M. S. Park
    • R. Arróyave

    OriginalPaper 16 June 2009 Pages: 2525 - 2533

15. Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging

    • Kai-Jheng Wang
    • Jenq-Gong Duh

    OriginalPaper 28 August 2009 Pages: 2534 - 2542

16. Reaction Mechanism and Mechanical Properties of the Flip-Chip Sn-3.0Ag-0.5Cu Solder Bump with Cu/Ni-xCu/Ti Underbump Metallization After Various Reflows

    • Chung-Nan Peng
    • Jenq-Gong Duh

    OriginalPaper 12 September 2009 Pages: 2543 - 2553

17. Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu

    • Yong-Jun Oh
    • Sung-Yong Oh

    OriginalPaper 11 August 2009 Pages: 2554 - 2562

18. The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples

    • W.H. Wu
    • H.L. Chung
    • C.E. Ho

    OriginalPaper 07 July 2009 Pages: 2563 - 2572

19. Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders

    • Y. H. Hsiao
    • H. W. Tseng
    • C. Y. Liu

    OriginalPaper 18 August 2009 Pages: 2573 - 2578

20. TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface

    • P. J. Shang
    • Z. Q. Liu
    • J. K. Shang

    OriginalPaper 28 July 2009 Pages: 2579 - 2584

21. The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects

    • Christopher Kinney
    • Tae-Kyu Lee
    • J. W. Morris

    OriginalPaper Open access 16 June 2009 Pages: 2585 - 2591

22. ENIG Corrosion Induced by Second-Phase Precipitation

    • John Osenbach
    • Ahmed Amin
    • John DeLucca

    OriginalPaper 16 September 2009 Pages: 2592 - 2599

23. Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting

    • John L. Wagner
    • Peter F. Ladwig
    • Galen Houk

    OriginalPaper 18 August 2009 Pages: 2600 - 2609

24. Estimation Method for Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Profiles

    • Hiroshi Nishikawa
    • Yoshihito Hamada
    • Tadashi Takemoto

    OriginalPaper 18 August 2009 Pages: 2610 - 2616

25. Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders

    • Babak Arfaei
    • Eric Cotts

    OriginalPaper 10 September 2009 Pages: 2617 - 2627

26. Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework

    • Polina Snugovsky
    • Zohreh Bagheri
    • Craig Hamilton

    OriginalPaper 25 August 2009 Pages: 2628 - 2646

27. Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films

    • Fu Guo
    • Guangchen Xu
    • C. Henry Wang

    OriginalPaper 13 August 2009 Pages: 2647 - 2658

28. Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints

    • Takayuki Kobayashi
    • Andre Lee
    • K. N. Subramanian

    OriginalPaper 28 July 2009 Pages: 2659 - 2667

29. Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier

    • Seongjun Kim
    • Keun-Soo Kim
    • Goro Izuta

    OriginalPaper 28 August 2009 Pages: 2668 - 2675

30. Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu₆Sn₅ Intermetallic Compound

    • Eric Buchovecky
    • Nitin Jadhav
    • Eric Chason

    OriginalPaper Open access 12 August 2009 Pages: 2676 - 2684

31. Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints

    • Tae-Kyu Lee
    • Kuo-Chuan Liu
    • Thomas R. Bieler

    OriginalPaper Open access 01 July 2009 Pages: 2685 - 2693

32. Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s

    • Thomas R. Bieler
    • Adwait U. Telang

    OriginalPaper 18 August 2009 Pages: 2694 - 2701

33. Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

    • Bite Zhou
    • Thomas R. Bieler
    • Kuo-Chuan Liu

    OriginalPaper 28 August 2009 Pages: 2702 - 2711

34. Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation

    • Thomas R. Bieler
    • Tae-kyu Lee
    • Kuo-Chuan Liu

    OriginalPaper 18 August 2009 Pages: 2712 - 2719

35. Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology

    • Teymur Bakhishev
    • Vivek Subramanian

    OriginalPaper Open access 18 August 2009 Pages: 2720 - 2725

36. The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth

    • Aleksandra Dimitrovska
    • Radovan Kovacevic

    OriginalPaper 18 August 2009 Pages: 2726 - 2734

37. Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications

    • I. Dutta
    • R. Raj
    • V. Wakharkar

    OriginalPaper 05 August 2009 Pages: 2735 - 2745

38. Mechanical Shock Behavior of Bulk Pure Sn Solder

    • K. E. Yazzie
    • H. Fei
    • N. Chawla

    OriginalPaper 28 July 2009 Pages: 2746 - 2755

39. Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration

    • Fu Guo
    • Guangchen Xu
    • Xiaoyan Li

    OriginalPaper 16 September 2009 Pages: 2756 - 2761

40. Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages

    • Tung-Han Chuang
    • Chih-Yuan Cheng
    • Tao-Chih Chang

    OriginalPaper 13 August 2009 Pages: 2762 - 2769

41. Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design

    • Iver E. Anderson
    • Jason W. Walleser
    • Alfred Kracher

    OriginalPaper 12 September 2009 Pages: 2770 - 2779

42. Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration

    • Albert T. Wu
    • K.H. Sun

    OriginalPaper 28 August 2009 Pages: 2780 - 2785

43. Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays

    • Albert T. Wu
    • Chun-Yang Tsai
    • Ching-Shun Ku

    Erratum 18 November 2009 Pages: 2786 - 2786