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The online version of the original article can be found under doi:10.1007/s11664-009-0934-9.
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Wu, A.T., Tsai, CY., Kao, CL. et al. Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays. J. Electron. Mater. 38, 2786 (2009). https://doi.org/10.1007/s11664-009-1004-z
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DOI: https://doi.org/10.1007/s11664-009-1004-z