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Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy

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To study the intragranular mechanical behavior of a Sn-Ag-Cu solder, a focused ion beam system was used to manufacture a notched microspecimen at a eutectic area within a grain. A low-speed tensile test was performed on the microspecimen using an Instron 5848 microtester at room temperature. The results show that, besides an obvious shearing deformation, a large number of subgrains are formed in the β-Sn matrix. Subgrain boundaries are composed of a large number of dislocations. Besides the heterogeneous deformation due to the notch, Ag3Sn intermetallic compounds influence the evolution path of subgrain boundaries.

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References

  1. Q. Xiao and W.D. Armstrong, J. Electron. Mater. 34, 196 (2005).

    Article  CAS  ADS  Google Scholar 

  2. Q. Zeng, Z. Wang, A. Xian, and J.K. Shang, J. Electron. Mater. 34, 62 (2005).

    Article  CAS  ADS  Google Scholar 

  3. K. Zeng and K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002).

    Article  Google Scholar 

  4. K.N. Tu, A.M. Gusak, and M. Li, J. Appl. Phys. 93, 1335 (2003).

    Article  CAS  ADS  Google Scholar 

  5. A. LaLonde, D. Emelander, J. Jeannette, C. Larson, W. Rietz, D. Swenson, and D.W. Henderson, J. Electron. Mater. 33, 1545 (2004).

    Article  CAS  ADS  Google Scholar 

  6. A.U. Telang, T.R. Bieler, J.P. Lucas, K.N. Subramanian, L.P. Lehman, Y. Xing, and E.J. Cotts, J. Electron. Mater. 33, 1412 (2004).

    Article  CAS  ADS  Google Scholar 

  7. A.U. Telang and T.R. Bieler, Scripta Mater. 52, 1027 (2005).

    Article  CAS  Google Scholar 

  8. J. Gong, C. Liu, P.P. Conway, and V.V. Silberschmidt, Proc. 56th of Electron. Comp. and Technol. Conf. (San Diego, NJ: IEEE, 2006), pp. 250–257.

  9. J. Gong, C. Liu, P.P. Conway, and V.V. Silberschmidt, Proc. 57th of IEEE Electron. Comp. and Technol. Conf. (Reno, NJ: IEEE, 2007), pp. 677–683.

  10. J. Gong, C. Liu, P.P. Conway, and V.V. Silberschmidt, Comp. Mater. Sci. 39, 187 (2007).

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. Department of Materials, University of Oxford, Parks Road, Oxford, OX1-3PH, UK

    Jicheng Gong

  2. Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, LE11-3TU, UK

    Paul P. Conway, Changqing Liu & Vadim V. Silberschmidt

Authors
  1. Jicheng Gong
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  2. Paul P. Conway
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  3. Changqing Liu
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  4. Vadim V. Silberschmidt
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Correspondence to Jicheng Gong.

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Gong, J., Conway, P.P., Liu, C. et al. Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy. J. Electron. Mater. 38, 2429–2435 (2009). https://doi.org/10.1007/s11664-009-0871-7

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  • DOI: https://doi.org/10.1007/s11664-009-0871-7

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