1. Foreword

   • W. Jud Ready
   • Apparao M. Rao

   EditorialNotes Pages: 191 - 191

2. Chemical vapor deposition synthesis of self-aligned carbon nanotube arrays

   • Stephan P. Turano
   • Jud Ready

   OriginalPaper Pages: 192 - 194

3. A rapid growth of aligned carbon nanotube films and high-aspect-ratio arrays

   • Lingbo Zhu
   • Jianwen Xu
   • C. P. Wong

   OriginalPaper Pages: 195 - 199

4. Indium and tin oxide nanowires by vapor-liquid-solid growth technique

   • Pho Nguyen
   • Sreeram Vaddiraju
   • M. Meyyappan

   OriginalPaper Pages: 200 - 206

5. Molecular dynamics study of bamboo-like carbon nanotube nucleation

   • Feng Ding
   • Kim Bolton
   • Arne Rosén

   OriginalPaper Pages: 207 - 210

6. Synthesis optimization and characterization of multiwalled carbon nanotubes

   • Christian P. Deck
   • Gregg S. B. McKee
   • Kenneth S. Vecchio

   OriginalPaper Pages: 211 - 223

7. Effect of the fabrication method on the electrical properties of poly(acrylonitrile-co-butadiene-co-styrene)/carbon black composites

   • Sidhartha Gupta
   • Runqing Ou
   • Rosario A. Gerhardt

   OriginalPaper Pages: 224 - 229

8. Bonding parameters of blanket copper wafer bonding

   • K. N. Chen
   • A. Fan
   • R. Reif

   OriginalPaper Pages: 230 - 234

9. A diameter-selective chiral separation of single-wall carbon nanotubes using nitronium lons

   • Kay Hyeok An
   • Chol-Min Yang
   • Young Hee Lee

   OriginalPaper Pages: 235 - 242

10. Optimization of active region for 1.3-µm GalnAsP compressive-strain multiple-quantum-well ridge waveguide laser diodes

    • Po-Hsun Lei
    • Chyi-Dar Yang
    • Wen-Jeng Ho

    OriginalPaper Pages: 243 - 249

11. Reliability of lead-free interconnections under consecutive thermal and mechanical loadings

    • T. T. Mattila
    • J. K. Kivilahti

    OriginalPaper Pages: 250 - 256

12. Developing an analytic methodology to accurately predict probing depth in integrated circuit structures

    • K. M. Chen
    • K. N. Chiang

    OriginalPaper Pages: 257 - 265

13. A comparative study of metamorphic InP/InGaAs double heterojunction bipolar transistors with InP and InAIP buffer layers grown by molecular beam epitaxy

    • Yongkun Sin
    • Nathan Presser
    • Paul Adams

    OriginalPaper Pages: 266 - 272

14. Electroless nickel/gold bump in the flip-chip-type CMOS package for mobile-phone camera modules

    • Joong-Do Kim

    OriginalPaper Pages: 273 - 278

15. Innovative wire bonding method using a chemically reacted thin layer for chips with copper interconnects

    • Yeau Ren Jeng
    • Sang Mao Chiu

    OriginalPaper Pages: 279 - 283

16. Lead contamination of a transient liquid-phase-processed Sn-Bi lead-free solder paste

    • M. Whitney
    • S. F. Corbin

    OriginalPaper Pages: 284 - 291

17. Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder

    • Chin-Kuang Lin
    • Chun-Ming Huang

    OriginalPaper Pages: 292 - 301

18. Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes

    • T. H. Chuang
    • S. F. Yen
    • M. D. Cheng

    OriginalPaper Pages: 302 - 309

19. Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish

    • Tung-Han Chuang
    • Shiu-Fang Yen
    • Hui-Min Wu

    OriginalPaper Pages: 310 - 318

20. Influence of Mn incorporation on MBE growth of (In,Mn)N

    • Gan Feng
    • Masahiro Yoshimoto

    OriginalPaper Pages: 319 - 322

21. Solid-state reaction in an Au wire connection with an Al-Cu pad during aging

    • Guh-Yaw Jang
    • Jenq-Gong Duh
    • David Su

    OriginalPaper Pages: 323 - 332

22. Characterization technique in phase distribution during sample preparation for applications to solder joints and wire-bonding chips

    • Hung-Kai Chen
    • Shih-Hai Li
    • Jenq-Gong Duh

    OriginalPaper Pages: 333 - 342

23. Phase distribution and phase analysis in Cu₆Sn₅, Ni₃Sn₄, and the Sn-rich corner in the ternary Sn-Cu-Ni isotherm at 240°C

    • Chia-Ying Li
    • Guo-Jyun Chiou
    • Jenq-Gong Duh

    OriginalPaper Pages: 343 - 352

24. Study of wetting reaction between eutectic AuSn and Au foil

    • Y. T. Lai
    • C. Y. Liu

    OriginalPaper Pages: 353 - 359

25. Effects of annealing on the thermoelectric and microstructural properties of deformed n-type Bi₂Te₃-based compounds

    • D. M. Lee
    • C. H. Lim
    • C. H. Lee

    OriginalPaper Pages: 360 - 365

26. Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples

    • C. W. Chang
    • Q. P. Lee
    • C. R. Kao

    OriginalPaper Pages: 366 - 371

27. Effects of strain rates and biaxial stress conditions on plastic yielding and flow stress of solder alloys

    • J. Liang
    • N. Dariavach
    • Z. Fang

    OriginalPaper Pages: 372 - 379