Skip to main content
SpringerLink
Log in

Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

The intermetallic compounds (IMCs) formed during the reflow and aging of Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes were investigated. After reflow, the thickness of (Cu, Ni, Au)6Sn5 interfacial IMCs in Sn3Ag0.5Cu0.06Ni0.01Ge was similar to that in the Sn3Ag0.5Cu specimen. The interiors of the solder balls in both packages contained Ag3Sn precipitates and brick-shaped AuSn4 IMCs. After aging at 150°C, the growth thickness of the interfacial (Ni, Cu, Au)3Sn4 intermetallic layers and the consumption of the Ni surface-finished layer on Cu the pads in Sn3Ag0.5Cu0.06Ni0.01Ge solder joints were both slightly less than those in Sn3Ag0.5Cu. In addition, a coarsening phenomenon for AuSn4 IMCs could be observed in the solder matrix of Sn3Ag0.5Cu, yet this phenomenon did not occur in the case of Sn3Ag0.5Cu0.06Ni0.01Ge. Ball shear tests revealed that the reflowed Sn3Ag0.5Cu0.06Ni0.01Ge packages possessed bonding strengths similar to those of the Sn3Ag0.5Cu. However, aging treatment caused the ball shear strength in the Sn3Ag0.5Cu packages to degrade more than that in the Sn3Ag0.5Cu0.06Ni0.01Ge packages.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. K. Zeng and K.N. Tu,Mater. Sci. Eng. R 38, 55 (2002).

    Article  Google Scholar 

  2. M. Yamashita, S. Tada, K. Shiokawa, and Fuzi Electric Co., “Solder Alloys,” U.S. patent 6,179,935 B1 (2001).

  3. K. Habu, N. Takeda, H. Watanabe, H. Ooki, J. Abe, T. Saito, Y. Taniguchi, and K. Takayama,Proc. Int. Conf. Electron. Environment, (New York: IEEE, 1999), p. 21.

    Google Scholar 

  4. C.M. Chuang and K.L. Lin,J. Electron. Mater. 33, 1426 (2003).

    Article  Google Scholar 

  5. C.M. Chuang, P.C. Shi, and K.L. Lin,2002 Int. Symp. Electron. Mater. Packag., IEEE, 360 (2002).

  6. C.M. Chuang, P.C. Shi, and K.L. Lin,Proc. Int. Conf. Electron. Mater. Packag., (New York: IEEE, 2002), p. 360.

    Book  Google Scholar 

  7. S.F. Yen, H.M. Wu, and T.H. Chuang,J. Electron. Mater. 35, 310 (2005).

    Google Scholar 

  8. T.H. Chuang, S.Y. Chang, L.C. Tsao, W.P. Weng, and H.M. Wu,J. Electron. Mater. 32, 195 (2003).

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Institute of Materials Science and Engineering, National Taiwan University, 106, Taipei, Taiwan

    S. F. Yen & M. D. Cheng

Authors
  1. T. H. Chuang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. S. F. Yen
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. M. D. Cheng
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Chuang, T.H., Yen, S.F. & Cheng, M.D. Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes. J. Electron. Mater. 35, 302–309 (2006). https://doi.org/10.1007/BF02692450

Download citation

  • Received:

  • Accepted:

  • Issue Date:

  • DOI: https://doi.org/10.1007/BF02692450

Key words

Search

Navigation