Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading T. T. MattilaJ. K. Kivilahti Regular Issue Paper Pages: 969 - 976
Advanced HiCTE flip chip packaging of 90-nm Cu/Low-K chips: Underfill, novel terminal pad structures, and processing optimization Surasit ChungpaiboonpatanaFrank G. Shi Regular Issue Paper Pages: 977 - 993
Influence of flux on wetting behavior of lead-free solder balls during the infrared-reflow process Cho-Liang ChungKyoung-Sik MoonC. P. Wong Regular Issue Paper Pages: 994 - 1001
Room-temperature indentation creep of lead-free Sn-5%Sb solder alloy A. R. GeranmayehR. Mahmudi Regular Issue Paper Pages: 1002 - 1009
Changes in interfacial bonding energies in the chemical activation of GaAs surfaces Ning LiuThomas F. Kuech Regular Issue Paper Pages: 1010 - 1015
High-temperature variable melting point Sn-Sb lead-free solder pastes using transient liquid-phase powder processing S. F. Corbin Regular Issue Paper Pages: 1016 - 1025
Scanning electron microscopy study of the cross section of intermetallic compound in the solder ball on the plastic ball grid array package following reliability tests Yeh-Fang DuannJen-Hung ChiangHsun-Wen Chang Regular Issue Paper Pages: 1026 - 1029
Low-base-resistance InP/InGaAs heterojunction bipolar transistors with a compositionally graded-base structure K. OuchiH. OhtaT. Mishima Regular Issue Paper Pages: 1030 - 1034
High electric-field-induced strain beahvior of single-crystal Pb(Mg1/3Nb2/3)O3-xPbTiO3 multilayer piezoelectric actuators Zuyong FengHaimei LiWeiqing Jin Regular Issue Paper Pages: 1035 - 1039
Impression creep characterization of 90Pb-10Sn microelectronic solder balls at subsolvus and supersolvus temperatures D. PanI. DuttaS. Ma Regular Issue Paper Pages: 1040 - 1046
Hemisphere-shaped silicon crystal wafers obtained by plastic deformation and preparation of their solar cells Kazuo NakajimaKozo FujiwaraWugen Pan Regular Issue Paper Pages: 1047 - 1052
Ion bombardment-induced high orientation of Al/Ti films for surface acoustic wave device applications D. M. LiF. PanM. Liu Regular Issue Paper Pages: 1053 - 1058
Electron beam-induced current investigation of GaN Schottky diode A. MatoussiT. BoufadenA. Toureille Regular Issue Paper Pages: 1059 - 1064
Anomalously high tensile creep rates from thin cast Sn3.9Ag0.6Cu lead-free solder Qiang XiaoLuu NguyenWilliam D. Armstrong Regular Issue Paper Pages: 1065 - 1075
Structure and dielectric properties of Ba1−xSrxZnTi7O16 hollandite ceramics R. RemyaK. P. MuraliR. Ratheesh Regular Issue Paper Pages: 1076 - 1080
Lead-free interconnect technique by using variable frequency microwave Kyoung-Sik MoonYi LiC. P. Wong Regular Issue Paper Pages: 1081 - 1088
Fabrication and thermal evaluation of silicon on diamond wafers A. AleksovS. D. WolterZ. Sitar Regular Issue Paper Pages: 1089 - 1094
Enhanced gettering of iron impurities in bulk silicon by using external direct current electric field W. P. LeeE. P. TehT. Y. Tou Letter Pages: L25 - L29
