Abstract
A novel lead-free interconnect technique using variable frequency microwave (VFM) was investigated. The lead-free solder interconnection between the component chips and the metal pads through VFM was first demonstrated. Comparison between the microstructures of the lead-free solder joints on Cu and Sn surfaces formed by a conventional thermal reflow process and VFM was conducted. The VFM heating technique successfully created the lead-free solder/Cu and Sn joints through their intermetallic compounds (IMCs), while maintaining the substrate temperature as low as 210°C.
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Moon, KS., Li, Y., Xu, J. et al. Lead-free interconnect technique by using variable frequency microwave. J. Electron. Mater. 34, 1081–1088 (2005). https://doi.org/10.1007/s11664-005-0099-0
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DOI: https://doi.org/10.1007/s11664-005-0099-0