1. Thermal oxidation of polycrystalline and single crystalline aluminum nitride wafers

   • Z. Gu
   • J. H. Edgar
   • J. Chaudhuri

   Regular Issue Paper Pages: 1271 - 1279

2. Modeling of the zero-bias resistance-area product of long wavelength infrared HgCdTe-on-Si diodes fabricated from molecular beam epitaxy-grown epitaxial layers

   • Vishnu Gopal
   • Sudha Gupta

   Regular Issue Paper Pages: 1280 - 1286

3. The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb

   • W. H. Bang
   • K. H. Oh
   • Fay Hua

   Regular Issue Paper Pages: 1287 - 1300

4. Growth and properties of digitally-alloyed AlGaInP by solid source molecular beam epitaxy

   • O. Kwon
   • Y. Lin
   • S. A. Ringel

   Regular Issue Paper Pages: 1301 - 1306

5. Roughness and texture correlation of Al films

   • Wenjie Zhang
   • Leeward Yi
   • Jin Wu

   Regular Issue Paper Pages: 1307 - 1309

6. Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system

   • S. Tsukimoto
   • T. Sakai
   • Masanori Murakami

   Regular Issue Paper Pages: 1310 - 1312

7. A parametric approach for assessment of thermomechanical fatigue performance of Sn-based solder joints

   • K. N. Subramanian

   Regular Issue Paper Pages: 1313 - 1317

8. The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages

   • M. T. Sheen
   • Y. H. Ho
   • W. H. Cheng

   Regular Issue Paper Pages: 1318 - 1323

9. Scanning electron microscope in-situ investigation of fracture behavior in 96.5Sn3.5Ag lead-free solder

   • Ying Ding
   • Chunqing Wang
   • Mingyu Li

   Regular Issue Paper Pages: 1324 - 1335

10. Carbon-black thixotropic thermal pastes for improving thermal contacts

    • Chia-Ken Leong
    • Yasuhiro Aoyagi
    • D. D. L. Chung

    Regular Issue Paper Pages: 1336 - 1341

11. A comparative study of micropipe decoration and counting in conductive and semi-insulating silicon carbide wafers

    • Jianwei Wan
    • Seung-Ho Park
    • Mark Loboda

    Regular Issue Paper Pages: 1342 - 1348

12. Growth of II-IV-V₂ chalcopyrite nitrides by molecular beam epitaxy

    • J. E. van Nostrand
    • J. D. Albrecht
    • M. J. O’keefe

    Regular Issue Paper Pages: 1349 - 1356

13. Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

    • L. N. Ramanathan
    • J. W. Jang
    • D. R. Frear

    Letter Pages: L43 - L46