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A comparative study of micropipe decoration and counting in conductive and semi-insulating silicon carbide wafers

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Abstract

Micropipes are considered to be one of the most serious defects in silicon carbide (SiC) wafers affecting device yield. Developing a method to count and map micropipes accurately has been a challenging task. In this study, the different etching behavior of conductive and semi-insulating wafers in molten potassium oxide (KOH) is compared. Micropipes and closed-core screw dislocations exhibit different morphology after etching and can be easily distinguished with a polishing process. Based on a new sample preparation procedure and a digital imaging technique, a novel method of efficiently and reliably mapping and counting micropipes in both conductive and semi-insulating SiC wafers is developed.

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References

  1. P.G. Neudeck, W. Huang, M. Dudley, IEEE Trans. Electron Dev. 46, 478 (1999).

    Article  CAS  Google Scholar 

  2. F.C. Frank, Acta Cryst. 4, 497 (1951).

    Article  CAS  Google Scholar 

  3. J.R. Jenny, D.P. Malta, M.R. Calus, St.G. Muller, A.R. Powell, V.F. Tsvetkov, H.McD. Hobgood, R.C. Glass, and C.H. Carter, Jr., Mater. Sci. Forum 457–460, 35 (2004).

    Google Scholar 

  4. A.P. Powell, R.T. Leonard, M.F. Brady, St.G. Muller, V.F. Tsvetkov, R. Trussell, J.J. Sumakeris, H.McD. Hobgood, A.A. Burk, R.C. Glass, and C.H. Carter, Jr., Mater. Sci. Forum 457–460, 41 (2004).

    Google Scholar 

  5. X. Ma and T. Sudarshan, J. Electron. Mater. 33, 450 (2004).

    Article  CAS  Google Scholar 

  6. E. Emorhokpor, T. Kerr, I. Zwieback, W. Elkington, M. Dudley, T. Anderson, and J. Chen, Mater. Res. Soc. Symp. Proc. 815, J5.19.1 (2003).

  7. H. Saitoh and T. Kimoto, Mater. Sci. Forum 483–485, 89 (2005).

    Article  Google Scholar 

  8. J. Takahashi, M. Kanaya, and T. Hoshino, Int. Physics Conf. Ser. No. 137 (ICSCRM93, IOP Publishing, 1994), pp. 13–16.

  9. M. Katsuno, N. Ohtani, J. Takahashi, H. Yashiro, and M. Kanaya, Jpn. J. Appl. Phys. 38, 4661 (1999).

    Article  CAS  Google Scholar 

  10. M. Katsuno, N. Ohtani, J. Takahshi, H. Yashiro, M. Kanya, and S. Shinoyama, Mater. Sci. Forum 264–268, 837 (1998).

    Google Scholar 

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Authors and Affiliations

  1. Dow Corning Coporate, 48686, Midland, MI

    Jianwei Wan, Seung-Ho Park, Gilyong Chung & Mark Loboda

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  1. Jianwei Wan
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  2. Seung-Ho Park
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  3. Gilyong Chung
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  4. Mark Loboda
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Wan, J., Park, SH., Chung, G. et al. A comparative study of micropipe decoration and counting in conductive and semi-insulating silicon carbide wafers. J. Electron. Mater. 34, 1342–1348 (2005). https://doi.org/10.1007/s11664-005-0260-9

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  • DOI: https://doi.org/10.1007/s11664-005-0260-9

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