Thermal oxidation of polycrystalline and single crystalline aluminum nitride wafers Z. GuJ. H. EdgarJ. Chaudhuri Regular Issue Paper Pages: 1271 - 1279
Modeling of the zero-bias resistance-area product of long wavelength infrared HgCdTe-on-Si diodes fabricated from molecular beam epitaxy-grown epitaxial layers Vishnu GopalSudha Gupta Regular Issue Paper Pages: 1280 - 1286
The correlation between stress relaxation and steady-state creep of eutectic Sn-Pb W. H. BangK. H. OhFay Hua Regular Issue Paper Pages: 1287 - 1300
Growth and properties of digitally-alloyed AlGaInP by solid source molecular beam epitaxy O. KwonY. LinS. A. Ringel Regular Issue Paper Pages: 1301 - 1306
Roughness and texture correlation of Al films Wenjie ZhangLeeward YiJin Wu Regular Issue Paper Pages: 1307 - 1309
Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system S. TsukimotoT. SakaiMasanori Murakami Regular Issue Paper Pages: 1310 - 1312
A parametric approach for assessment of thermomechanical fatigue performance of Sn-based solder joints K. N. Subramanian Regular Issue Paper Pages: 1313 - 1317
The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages M. T. SheenY. H. HoW. H. Cheng Regular Issue Paper Pages: 1318 - 1323
Scanning electron microscope in-situ investigation of fracture behavior in 96.5Sn3.5Ag lead-free solder Ying DingChunqing WangMingyu Li Regular Issue Paper Pages: 1324 - 1335
Carbon-black thixotropic thermal pastes for improving thermal contacts Chia-Ken LeongYasuhiro AoyagiD. D. L. Chung Regular Issue Paper Pages: 1336 - 1341
A comparative study of micropipe decoration and counting in conductive and semi-insulating silicon carbide wafers Jianwei WanSeung-Ho ParkMark Loboda Regular Issue Paper Pages: 1342 - 1348
Growth of II-IV-V2 chalcopyrite nitrides by molecular beam epitaxy J. E. van NostrandJ. D. AlbrechtM. J. O’keefe Regular Issue Paper Pages: 1349 - 1356
Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy L. N. RamanathanJ. W. JangD. R. Frear Letter Pages: L43 - L46