1. Preface

   • K. N. Subramanian

   EditorialNotes 08 September 2006 Pages: 1 - 2

2. Thermodynamics and phase diagrams of lead-free solder materials

   • H. Ipser
   • H. Flandorfer
   • U. Saeed

   OriginalPaper 14 September 2006 Pages: 3 - 17

   

3. Phase Diagrams of Pb-Free Solders and their Related Materials Systems

   • Sinn-Wen Chen
   • Chao-Hong Wang
   • Chen-Nan Chiu

   OriginalPaper 01 September 2006 Pages: 19 - 37

   

4. The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

   • D. Swenson

   OriginalPaper 08 September 2006 Pages: 39 - 54

   

5. Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

   • Iver E. Anderson

   OriginalPaper 27 September 2006 Pages: 55 - 76

   

6. Rare-earth additions to lead-free electronic solders

   • C. M. L. Wu
   • Y. W. Wong

   OriginalPaper 12 September 2006 Pages: 77 - 91

   

7. Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders

   • Paul T. Vianco
   • Jerome A. Rejent
   • Michael K. Neilsen

   OriginalPaper 23 September 2006 Pages: 93 - 119

   

8. Sn–Zn low temperature solder

   • Katsuaki Suganuma
   • Kuen-Soo Kim

   OriginalPaper 01 September 2006 Pages: 121 - 127

   

9. Composite lead-free electronic solders

   • Fu Guo

   OriginalPaper 22 September 2006 Pages: 129 - 145

   

10. Processing and material issues related to lead-free soldering

    • Laura J. Turbini

    OriginalPaper 12 September 2006 Pages: 147 - 154

    

11. Interfacial reaction issues for lead-free electronic solders

    • C. E. Ho
    • S. C. Yang
    • C. R. Kao

    OriginalPaper 22 September 2006 Pages: 155 - 174

    

12. Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

    • N. Chawla
    • R. S. Sidhu

    OriginalPaper 12 September 2006 Pages: 175 - 189

    

13. Deformation behavior of tin and some tin alloys

    • Fuqian Yang
    • J. C. M. Li

    OriginalPaper 13 October 2006 Pages: 191 - 210

    

14. Mechanical fatigue of Sn-rich Pb-free solder alloys

    • J. K. Shang
    • Q. L. Zeng
    • Q. S. Zhu

    OriginalPaper 12 September 2006 Pages: 211 - 227

    

15. Life expectancies of Pb-free SAC solder interconnects in electronic hardware

    • Michael Osterman
    • Abhijit Dasgupta

    OriginalPaper 23 September 2006 Pages: 229 - 236

    

16. Assessment of Factors Influencing Thermomechanical Fatigue Behavior of Sn-Based Solder Joints under Severe Service Environments

    • K. N. Subramanian

    Original Paper 20 September 2006 Pages: 237 - 246

    

17. Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

    • Seung-Hyun Chae
    • Xuefeng Zhang
    • Lakshmi N. Ramanathan

    OriginalPaper 22 September 2006 Pages: 247 - 258

    

18. Electromigration issues in lead-free solder joints

    • Chih Chen
    • S. W. Liang

    OriginalPaper 08 September 2006 Pages: 259 - 268

    

19. Stress analysis of spontaneous Sn whisker growth

    • K. N. Tu
    • Chih Chen
    • Albert T. Wu

    OriginalPaper 01 September 2006 Pages: 269 - 281

    

20. Sn-whiskers: truths and myths

    • J. W. Osenbach
    • J. M. DeLucca
    • F. A. Baiocchi

    OriginalPaper 23 September 2006 Pages: 283 - 305

    

21. Tin pest issues in lead-free electronic solders

    • W. J. Plumbridge

    OriginalPaper 27 September 2006 Pages: 307 - 318

    

22. Issues related to the implementation of Pb-free electronic solders in consumer electronics

    • D. R. Frear

    OriginalPaper 08 September 2006 Pages: 319 - 330

    

23. Impact of the ROHS directive on high-performance electronic systems

    • Karl J. Puttlitz
    • George T. Galyon

    OriginalPaper 22 September 2006 Pages: 331 - 346

    

24. Impact of the ROHS Directive on high-performance electronic systems

    • Karl J. Puttlitz
    • George T. Galyon

    OriginalPaper 22 September 2006 Pages: 347 - 365