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Adhesive Chemistry

Developments and Trends

  • Book
  • © 1984

Overview

Editors:
  1. Lieng-Huang Lee

    1. Webster Research Center, Xerox Corporation, Webster, USA

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Part of the book series: Polymer Science and Technology Series (POLS, volume 29)

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Table of contents (50 chapters)

  1. Front Matter

    Pages i-xii
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  2. Chemistry of Adhesion—The Importance of Interface

    1. Front Matter

      Pages 1-1
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    2. Introductory Remarks

      • Lieng-Huang Lee
      Pages 3-4

    3. Recent Developments in Adhesive and Sealant Chemistry

      • Lieng-Huang Lee
      Pages 5-62

    4. Overview of Adherence Phenomena

      • Daniel Maugis
      Pages 63-93

    5. An Analytical Method for Determining the Surface Energy of Solid Polymers

      • Michael C. H. Lee
      Pages 95-120

    6. Effect of Amine Surface Treatment on the Adhesion of a Polyurethane to the Surface

      • Fasi Liang, Patricia Dreyfuss
      Pages 121-138

    7. Effect of Silane on Glass/Resin Adhesion Strength

      • Yona Eckstein, Elisabeth J. Berger
      Pages 139-163

    8. Discussion

      • L. H. Lee
      Pages 165-168

  3. Physics of Adhesion — Characterization of Surface and Bulk of Adhesive Systems

    1. Front Matter

      Pages 169-169
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    2. Introductory Remarks

      • Louis H. Sharpe
      Pages 171-174

    3. New Applications of ESCA

      • D. Briggs
      Pages 175-192

    4. Fracto-Emission Accompanying Adhesive Failure

      • J. T. Dickinson
      Pages 193-243

    5. Monitoring Epoxy Cure Kinetics with a Viscosity-Dependent Fluorescent Probe

      • R. L. Levy, D. P. Ames
      Pages 245-256

    6. Dynamic Mechanical Properties of Silicone Pressure-Sensitive Adhesives

      • B. C. Copley
      Pages 257-267

    7. The Viscoelastic Properties of Pressure-Sensitive Adhesives

      • J. B. Class, S. G. Chu
      Pages 269-296

    8. Block Copolymer Adhesive Studies

      • T. C. Ward, Anne Wood Brinkley, Margaret Sheridan, Paul Koning
      Pages 297-310

    9. Discussion

      • J. T. Dickinson
      Pages 311-313

  4. Radiation-Curable Adhesives

    1. Front Matter

      Pages 315-315
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    2. Introductory Remarks

      • V. D. McGinniss
      Pages 317-318
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Keywords

About this book

Since the first symposium on Recent Advances in Adhesion, held September, 1971 in Washington, D. C. , this Division of the American Chemical Society has continuously sponsored several symposia on adhesion and adhesives. The chemists have gradually realized the importance of adhesion in various fields of science and technology. During these years, the science of adhesion has steadily grown along with progress in surface science and fracture mechanics. Moreover, new adhesives have been invented and applied in actual structures, for example, structural and aerospace adhesives. In response to socio-economic demands, new forms of adhesives have been introduced to combat the problems of pollution and to promote energy-conservation. The developments of hot-melt adhesives, waterborne adhesives, and radiation-curable adhesives are vivid examples of successes in solving some of the problems. As chemists, our hatural desire is to understand how those new adhesives and new forms of adhesives are made. Thus, we are interested in learning about the chemistry of adhesives so that we may create new generations of materials to satisfy future needs. It was based on this common interest that w~ set forth to org'anize this Symposium on Recent Developments in Adhesive Chemistry. It was held from March 21 through 23, 1983 in the Westin Hotel, Seattle, Washington. The Symposium was very well attended. As a matter of fact, for the first two sessions, we had to move from the smaller Mt. St.

Editors and Affiliations

  • Webster Research Center, Xerox Corporation, Webster, USA

    Lieng-Huang Lee

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