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Block Copolymer Adhesive Studies

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Adhesive Chemistry

Part of the book series: Polymer Science and Technology ((POLS,volume 29))

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Abstract

The thermal and dynamic mechanical behaviors of triblock copolymers with a styrene/isoprene/styrene architecture were investigated in order to understand their adhesive properties. Both copolymer free films and films bonding together two titanium alloy plates were found to have thermal and mechanical response that was strongly dependent on joint preparation. Microphase separation in the melts of these triblock materials was felt to contribute to the observed phenomena; namely, the presence of residual stresses in thin films which had been cooled while under high pressure.

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Author information

Authors and Affiliations

  1. Department of Chemistry and Polymer Materials and Interfaces Laboratory, Virginia Polytechnic Institute and State University, Blacksburg, VA, 24061, USA

    T. C. Ward, Anne Wood Brinkley, Margaret Sheridan & Paul Koning

Authors
  1. T. C. Ward
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  2. Anne Wood Brinkley
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  3. Margaret Sheridan
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  4. Paul Koning
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Editor information

Editors and Affiliations

  1. Webster Research Center, Xerox Corporation, Webster, New York, USA

    Lieng-Huang Lee

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© 1984 Plenum Press, New York

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Ward, T.C., Brinkley, A.W., Sheridan, M., Koning, P. (1984). Block Copolymer Adhesive Studies. In: Lee, LH. (eds) Adhesive Chemistry. Polymer Science and Technology, vol 29. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-2435-5_14

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  • DOI: https://doi.org/10.1007/978-1-4613-2435-5_14

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4612-9481-8

  • Online ISBN: 978-1-4613-2435-5

  • eBook Packages: Springer Book Archive

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