Abstract
The use of electromagnetic radiation induced polymerization reactions to produce rapid setting coating and adhesive systems has increased dramatically in the time period between 1979 to 1983. There are, of course, many alternatives to radiation-curable adhesives such as 100% solids reactive hot melt materials; water and solvent base adhesives (low and high solids content); two component-single component room temperature-elevated temperature cure adhesives and even gas-phase initiated curing of blocked isocyanate adhesive formulations. But even with these competing technologies, radiation-curable adhesive systems have several distinct advantages over conventional methods of applying, drying and setting historical adhesive formulations.
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© 1984 Plenum Press, New York
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McGinniss, V.D. (1984). Introductory Remarks. In: Lee, LH. (eds) Adhesive Chemistry. Polymer Science and Technology, vol 29. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-2435-5_16
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DOI: https://doi.org/10.1007/978-1-4613-2435-5_16
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4612-9481-8
Online ISBN: 978-1-4613-2435-5
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