Thermomechanical behavior at the nanoscale and size effects in shape memory alloys Jose San JuanMaria L. NóChristopher A. Schuh Invited Feature Paper 01 October 2011 Pages: 2461 - 2469
Nanoimprinted complementary organic electronics: Single transistors and inverters Thomas RothländerUrsula PalfingerPaul Hartmann Invited Feature Paper 01 October 2011 Pages: 2470 - 2478
Aluminum nanocomposites having wear resistance better than stainless steel Linan AnJun QuPeter J. Blau Materials Communications 01 October 2011 Pages: 2479 - 2483
High-temperature deformation processing maps for a NiTiCu shape memory alloy Vyasa V. ShastryBikas MajiUpadrasta Ramamurty Article 01 October 2011 Pages: 2484 - 2492
Dielectric relaxations of high-k poly(butylene succinate) based all-organic nanocomposite films for capacitor applications Li YuShanming KeHaitao Huang Article 01 October 2011 Pages: 2493 - 2502
A microwave dielectric material for microstrip patch antenna substrate Qingwei LiaoLingxia LiWei Zhang Article 01 October 2011 Pages: 2503 - 2510
Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system—Computational simulation and experimental studies Lei ChenKong Boon YeapGui Rong Liu Article 01 October 2011 Pages: 2511 - 2523
The effects of low temperature and pressure on the fracture behaviors of organosilicate thin films Soheil BarakatPearl Lee-SullivanTing Y. Tsui Article 01 October 2011 Pages: 2524 - 2532
Analyzing mechanical properties of a nanocrystalline Fe–Ni coating by nanoindentation Lian-Hao YiChun-Ying LeePo-We Kao Article 01 October 2011 Pages: 2533 - 2542
Microstructures and electrical properties of CaCu3Ti4O12 thin films on Pt/TiO2/SiO2/Si substrates by pulsed laser deposition Sung-Yun LeeSoon-Mi ChoiKyoung Jin Choi Article 01 October 2011 Pages: 2543 - 2551
Thermally induced damages of PECVD SiNx thin films Yinong LiuNeerushana JehanathanJohn Dell Article 01 October 2011 Pages: 2552 - 2557
Nanoscale planar faulting in nanocrystalline Ni–W thin films: Grain growth, segregation, and residual stress Udo WelzelJohannes KümmelEric Jan Mittemeijer Article 01 October 2011 Pages: 2558 - 2573