Steel and science bring dinosaurs into the 21st century at the carnegie museum of natural history Maureen Byko Materials World 18 October 2008 Pages: 12 - 16
Broadening of MSE: The role of (and challenges to) professional societies Diran Apelian Presidential Perspective 18 October 2008 Pages: 18 - 19
Biological materials science and engineering: Biological materials, biomaterials, and biomimetics M. A. MeyersA. M. HodgeR. K. Roeder Commentary 18 October 2008 Pages: 21 - 22
Structural biological materials: Overview of current research P. -Y. ChenA. Y. -M. LinM. A. Meyers Overview 18 October 2008 Pages: 23 - 32
Aging and fracture of human cortical bone and tooth dentin Kurt J. KoesterJoel W. Ager IIIRobert O. Ritchie Overview 18 October 2008 Pages: 33 - 38
Aging and loading rate effects on the mechanical behavior of equine bone Robb M. KulinFengchun JiangKenneth S. Vecchio Research Summary 18 October 2008 Pages: 39 - 44
The development of biocomposite nanofibers for tissue scaffolding applications Y. Z. ZhangC. T. Lim Overview 18 October 2008 Pages: 45 - 48
The nanoindentation of soft tissue: Current and developing approaches Oliver FrankeMathias GökenAndrea M. Hodge Research Summary 18 October 2008 Pages: 49 - 53
Porous ceramic scaffolds with complex architectures E. MunchJ. FrancoA. P. Tomsia Research Summary 18 October 2008 Pages: 54 - 58
Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technology C. Robert Kao Commentary 18 October 2008 Pages: 60 - 60
The root causes of the “Black pad” phenomenon and avoidance tactics Katsuaki SuganumaKuen-Soo Kim Overview 18 October 2008 Pages: 61 - 65
An overview of Pb-free, flip-chip wafer-bumping technologies Sung K. KangPeter GruberDa-Yuan Shih Overview 18 October 2008 Pages: 66 - 70
A novel low-temperature solder based on intermetallic-compound phases: Alloy design, high-homologous temperature properties, and reliability Daewoong SuhChi-won HwangJun Sugimoto Research Summary 18 October 2008 Pages: 71 - 76
The effect of pre-aging on the electromigration of flip-chip SnAg solder joints Po-Chun YangChien-Chih KuoChih Chen Overview 18 October 2008 Pages: 77 - 80
The thin-film deposition of conjugated molecules for organic electronics Michael H. -C. Jin Overview 18 October 2008 Pages: 81 - 86
Choosing a career path with the sloan career cornerstone center Kelly Roncone Zappas End Notes 18 October 2008 Pages: 96 - 96