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A novel low-temperature solder based on intermetallic-compound phases: Alloy design, high-homologous temperature properties, and reliability

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Abstract

A novel low-temperature solder that consists entirely of two phases of intermetallic compounds has been developed as a reliable low-temperature interconnect. The new solder can be reflowed below 125°C and yet exhibits excellent mechanical properties at homologous temperatures exceeding 0.9. Specifically, the new solder exhibits creep resistance an order of magnitude greater than conventional low-temperature solders, and strength retention ability exceeding that of Sn-4%Ag-0.5%Cu (SAC405) at the same homologous temperatures.

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Authors and Affiliations

  1. Intel Corporation, Technology and Manufacturing Group, Chandler, AZ, 85226, USA

    Daewoong Suh

  2. Intel Corporation, Technology and Manufacturing Group, Tsukuba, 300-3261, Japan

    Chi-won Hwang

  3. Senju Metal Industry Co., Ltd, Tokyo, 120-8555, Japan

    Minoru Ueshima & Jun Sugimoto

Authors
  1. Daewoong Suh
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  2. Chi-won Hwang
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  3. Minoru Ueshima
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  4. Jun Sugimoto
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Correspondence to Daewoong Suh.

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Suh, D., Hwang, Cw., Ueshima, M. et al. A novel low-temperature solder based on intermetallic-compound phases: Alloy design, high-homologous temperature properties, and reliability. JOM 60, 71–76 (2008). https://doi.org/10.1007/s11837-008-0076-1

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  • DOI: https://doi.org/10.1007/s11837-008-0076-1

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